Chip Inductor Anisotropic Plating High Aspect Ratio
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Solution Overview
Problem
Existing thin film inductors face challenges in achieving a high aspect ratio for their coil pattern portions without increasing the risk of short-circuits, which limits the inductance and efficiency of chip electronic components.
Innovation Solution
The solution involves forming internal coil parts with a first coil pattern part having a minimum interval of 15 μm or less and a maximum thickness to width ratio of 7 or more, utilizing anisotropic plating growth to prevent short-circuits and enhance the aspect ratio, thereby increasing the inductance while reducing direct current resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the coil pattern portion is increased to achieve a high aspect ratio, then the inductance is improved, but the risk of short-circuits between coil pattern portions increases
Solution Approach 1:
The patent applies different plating conditions to different regions of the coil pattern. The first coil pattern part is plated under conditions that promote vertical growth (high aspect ratio), while the second coil pattern part is plated under conditions that limit lateral growth. This local differentiation allows the first part to achieve high inductance through increased thickness without causing short-circuits, as the second part maintains proper spacing.
Solution Approach 2:
The coil pattern is divided into two distinct parts: a first coil pattern part and a second coil pattern part. Each part is formed with different plating characteristics - the first part has a higher thickness-to-width ratio achieved through controlled plating, while the second part serves as a protective layer. This segmentation allows optimization of each part's function independently, achieving high inductance while preventing short-circuits.
2Reliability
If the minimum interval between adjacent coil pattern portions is reduced to increase the aspect ratio, then the inductance is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent changes the plating parameters differently for the first and second coil pattern parts. The first part uses plating conditions that favor vertical deposition (higher current density, different bath composition), resulting in a thickness-to-width ratio of 0.5 or more. The second part uses conditions that favor lateral coverage. This parameter differentiation allows reduced interval between patterns while maintaining manufacturing feasibility and achieving high inductance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents short-circuits and achieves a high aspect ratio for the internal coil parts, leading to improved inductance and reduced direct current resistance, enhancing the performance of chip electronic components.
Implementation Method 1
utilizing anisotropic plating growth to prevent short-circuits and enhance the aspect ratio
Data Source
AI summary
There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a≤15 μm and b/a≥7 are satisfied.