Chip Inductor Insulating Layer for High Frequency Stability
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Solution Overview
Problem
In thin film inductors, the insulating layer is not extended to the lower portion of the coil pattern, leading to direct contact with magnetic materials, causing leakage current and waveform distortion at high frequencies, which reduces inductance.
Innovation Solution
A chip electronic component with an insulating layer extending to the lower side surface of the internal coil pattern, comprising a first insulating layer on the upper portion and a second insulating layer on the side surface, formed using a novolac based epoxy resin or rubber based polymer epoxy resin through vacuum processing, to prevent direct contact with magnetic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the insulating layer is only formed on the upper portion of the coil pattern, then the manufacturing process is simple, but the coil pattern directly contacts the magnetic material causing leakage current and waveform distortion
Solution Approach 1:
The insulating layer formation is extended from a two-dimensional surface coating (upper portion only) to a three-dimensional coverage including the side surface and lower portion of the coil pattern. This dimensional extension ensures complete insulation between the coil pattern and magnetic material, preventing leakage current while maintaining manufacturing feasibility through vacuum dipping process
Solution Approach 2:
The insulating layer acts as an intermediary substance between the coil pattern and magnetic material. By extending this intermediary layer to cover the side surface and lower portion of the coil pattern, complete electrical isolation is achieved, preventing direct contact and the resulting harmful effects while maintaining the simple manufacturing approach
2Ease of manufacture
If the insulating layer does not extend to the lower portion of the coil pattern, then the manufacturing process is easier, but inductance decreases rapidly at high frequency due to direct contact
Solution Approach 1:
The insulating layer coverage is extended from upper portion only to include the side surface and lower portion of the coil pattern through vacuum dipping. This three-dimensional coverage ensures complete insulation precision, preventing any direct contact between the coil pattern and magnetic material while maintaining ease of manufacture
Solution Approach 2:
The traditional mechanical coating method is replaced with vacuum dipping process. This substitution allows the insulating layer to automatically conform to the complex three-dimensional geometry of the coil pattern, achieving precise coverage of side surfaces and lower portions without complex alignment or application mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents waveform distortion and maintains inductance at high frequencies by ensuring no direct contact between the coil pattern and magnetic materials, enhancing the performance of the chip inductor.
Implementation Method 1
an insulating layer coating the internal conductor pattern part... to prevent a contact between the coil pattern and a magnetic material
Implementation Method 2
formed using a novolac based epoxy resin or rubber based polymer epoxy resin through vacuum processing
Data Source
AI summary
A chip electronic component may include an insulating layer formed on a lower portion of a side surface of an internal coil pattern to avoid a direct contact between the internal coil pattern and a magnetic material, thereby preventing a waveform distortion indicating a reduction in inductance at high frequency.