Chip Inductor Oxide Insulating Film High Frequency Waveform Defects
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Solution Overview
Problem
Conventional thin film inductors face issues with leakage currents and waveform defects at high frequencies due to the limitations in reducing the thickness of insulating films, which can lead to decreased inductance and increased DC resistance.
Innovation Solution
A chip electronic component with an oxide insulating film formed on the coil conductive pattern parts, made of metallic oxide containing at least one metal from the coil, is implemented, along with a polymer insulating film, to create a double insulating film structure that prevents contact with magnetic materials and maintains optimal inductance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating film thickness is reduced to improve inductance characteristics, then inductance increases and DC resistance decreases, but leakage currents and waveform defects occur at high frequencies
Solution Approach 1:
The insulating film is divided into two distinct layers: a first insulating film (oxide layer) in direct contact with the coil conductive pattern part, and a second insulating film (polymer layer) covering the first insulating film. This segmentation allows each layer to perform its specialized function - the oxide layer provides effective insulation at minimal thickness, while the polymer layer provides additional protection against leakage currents and waveform defects.
Solution Approach 2:
The patent uses a composite insulating film structure combining two different materials with complementary properties. The oxide material provides excellent insulation with minimal thickness, while the polymer material adds protective properties that prevent leakage currents and waveform defects. This composite structure resolves the contradiction by combining the advantages of both materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents leakage currents and waveform defects at high frequencies, ensuring reliable insulation and inductance performance by adjusting the thickness and surface roughness of the insulating films, thereby enhancing the inductance characteristics and reducing DC resistance.
Implementation Method 1
an oxide insulating film formed on a surface of the coil conductive pattern part, wherein the oxide insulating film is formed of a metallic oxide containing at least one metal forming the coil conductive pattern part
Data Source
AI summary
A chip electronic component may include: a magnetic body having a coil conductive pattern part embedded therein; and an oxide insulating film formed on a surface of the coil conductive pattern part. Even in the case that the insulating film is formed to be thinner than an insulating film, it may prevent the coil conductive pattern part from being exposed, whereby a magnetic material and the coil conductive pattern part may not contact each other. Therefore, a waveform defect may be prevented at a high frequency.