Chip Inductor Plating Spread Prevention via Phosphate Glass
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing process of thin film type inductors faces issues with plating spread defects due to surface roughness caused by mixing magnetic metal powders of different particle sizes, leading to delamination of insulation coating layers and subsequent plating defects during the formation of external electrodes.
Innovation Solution
A plating spreading prevention part containing phosphate-based glass is coated on the magnetic body to prevent plating spread, specifically formed by chemically re-coating exposed magnetic metal powder, which helps in maintaining the insulation coating integrity and preventing plating defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If magnetic metal powders of different particle sizes are mixed to form the magnetic body, then the manufacturing process is simplified and productivity is improved, but surface roughness increases causing plating spread defects
Solution Approach 1:
The patent applies preliminary action by forming a plating spreading prevention part on the magnetic body surface before the plating process. This preventive measure addresses the surface roughness issue caused by mixed particle sizes before plating occurs, preventing plating spread defects without requiring stricter control on particle size uniformity during magnetic body fabrication.
2Manufacturing precision
If a plating spreading prevention part is added to prevent plating defects, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The plating spreading prevention part is applied locally only where needed - on the surface of the magnetic body at the plating area. This localized approach improves plating quality without requiring complex structural modifications throughout the entire device, thus minimizing the increase in device complexity.
3Manufacturing precision
If the magnetic body surface is made smoother to prevent plating spread, then plating quality is improved, but magnetic permeability and Q characteristics deteriorate
Solution Approach 1:
The solution segments the magnetic body into two distinct parts: the internal magnetic metal powder that maintains optimal particle size for magnetic permeability and Q characteristics, and the surface plating spreading prevention part that provides a smooth plating surface. This segmentation allows each part to be optimized independently for its specific function.
Solution Approach 2:
The plating spreading prevention part acts as an intermediary layer between the rough magnetic body surface (caused by mixed particle sizes) and the plating process. This intermediary layer prevents direct contact between the plating solution and the rough surface, thereby preventing plating spread defects without requiring changes to the magnetic body's internal structure or particle size distribution.
4Reliability
If insulation coating layer is applied to protect magnetic metal powder, then reliability is improved, but plating spread defects occur due to delamination
Solution Approach 1:
The plating spreading prevention part is formed on the magnetic body surface before the plating process, creating a stable base layer that prevents plating spread. This preliminary action ensures that the insulation coating layer remains intact during plating, preventing delamination defects without compromising the insulation coating's protective function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces plating spread defects, enhances magnetic permeability and Q characteristics, and improves the reliability of external electrode formation by maintaining the insulation coating layer integrity.
Implementation Method 1
A plating spreading prevention part coated on a surface of the magnetic body, wherein the plating spreading prevention part contains phosphate-based glass
Data Source
AI summary
There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.