Chip-Infused 3D Printing Filament for Precise Sensor Embedding

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Solution Overview

Problem

Existing 3D printing technologies lack the capability to integrate sensors seamlessly within the printed structures, limiting the functionality and adaptability of 3D-printed objects.

Innovation Solution

The integration of chip-infused polymer filaments, where sensors are embedded within polymer filaments, allowing for precise placement and infusion during the 3D printing process, enabling the formation of structures with embedded sensors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional 3D printing is used, then manufacturing simplicity is maintained, but sensor integration capability is lost

Engineering Contradiction:
Improvesensor integration capabilityVSAvoidprinting process complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the sensor embedding process with the 3D printing process by infusing sensor-containing filaments directly into the printing extrusion system. This combines two previously separate operations (printing and sensor embedding) into a single integrated process, enabling sensor integration without requiring post-processing assembly steps.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Sensors are pre-loaded into the filament before the printing process begins. The filament is prepared in advance with sensors embedded or attached to it, allowing the printing system to deposit sensors at precise locations as part of the normal printing workflow, rather than requiring complex real-time sensor placement mechanisms.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If sensors are embedded in filaments, then manufacturing precision is improved, but filament complexity increases

Engineering Contradiction:
Improvesensor placement precisionVSAvoidfilament structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The filament is designed with localized sensor embedding rather than uniform modification throughout. Sensors are positioned at specific segments or regions of the filament corresponding to where they are needed in the final printed structure, allowing the rest of the filament to maintain its standard printing properties.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The filament acts as an intermediary carrier that simplifies the overall system architecture. Instead of requiring complex robotic manipulation or automated assembly systems to place sensors, the filament serves as a pre-configured delivery mechanism that passes sensors through the printing system to their final locations.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If multiple filament types are used, then structure adaptability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvestructure functionalityVSAvoidfilament handling ease
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The printing system is designed to handle multiple filament types through a universal loading and extrusion mechanism. The same basic printing hardware can accommodate different filament compositions (with or without sensors, different materials, different diameters) by simply changing the filament spool, without requiring complex reconfiguration of the extrusion system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12535796B2Embedded sensor chips in 3D and 4D printed structures through selective filament infusion
Publication Date: 2026.01.27 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US12535796B2 patent drawing
  • US12535796B2 patent drawing
  • US12535796B2 patent drawing

AI summary

A method, computer program, and computer system are provided for enabling chip-infused filament for 3D printing. A structure to be formed through 3D printing is identified. A type associated with one or more sensors embedded in a polymer filament and a location are determined for the one or more sensors within the structure. The structure may then be 3D printed with the one or more sensors at the location based on using the polymer filament at the location within the structure.