Chip Inspection Tray Handling System with Movable Platform

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Solution Overview

Problem

Traditional chip inspection systems for trays face challenges such as lengthy adjustment times due to varying tray sizes, risk of damage during adjustments, vibration-induced inaccuracies, and high costs due to slow chip replacement processes and cross-contamination risks.

Innovation Solution

A system comprising a movable support platform with multiple tray-handling apparatuses for different tray sizes, an unloading arm device, and a pick-and-place apparatus with separate pickup heads for defective and good chips, designed to minimize mechanical adjustments and prevent cross-contamination, with guide strips and positioning mechanisms for precise tray handling and inspection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional tray-handling devices are adjusted to fit different tray sizes, then the system can handle various tray dimensions, but the adjustment requires significant time increasing system downtime

Engineering Contradiction:
Improvetray size compatibilityVSAvoidadjustment time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The tray-handling device incorporates a movable support platform that can dynamically adjust its position to accommodate different tray sizes. The platform moves along guide rails to position trays of varying dimensions (2-inch, 3-inch, 4-inch) without requiring manual adjustment of the handling device itself, thus maintaining adaptability while minimizing adjustment time.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system divides the tray handling function into separate components: a fixed tray-handling device and a movable support platform. This segmentation allows the handling device to remain stationary while the platform adjusts tray positions, eliminating the need for time-consuming adjustments of the handling device itself.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If tray-handling devices are adjusted for different tray sizes, then various tray dimensions can be handled, but adjustment incurs risk of damaging processing products

Engineering Contradiction:
Improvetray size compatibilityVSAvoidproduct damage risk
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The movable support platform dynamically adjusts tray positions along guide rails, allowing the system to handle different tray sizes without moving the tray-handling device itself. This dynamic adjustment eliminates the risk of product damage associated with adjusting the handling device, as the platform's controlled movement along fixed rails ensures precise and safe positioning.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The movable support platform acts as an intermediary between the fixed tray-handling device and the trays of varying sizes. It mediates the size variation by absorbing the adjustment requirement through its own movement, thereby protecting the processing products from damage while maintaining compatibility with different tray dimensions.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If a single pickup head is used to remove defective chips and place good chips, then the device structure is simple, but cross-contamination risk increases

Engineering Contradiction:
Improvepickup head structureVSAvoidcross-contamination risk
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The pickup mechanism is segmented into two separate pickup heads: one dedicated to removing defective chips and another for placing good chips. This segmentation physically separates the functions, eliminating cross-contamination risk while maintaining relatively simple device structure. Each pickup head is optimized for its specific function, with the defective chip removal head positioned to access defective chips and the good chip placement head positioned for accurate placement.

Inventive Principle:
Principle #1Segmentation

4Device complexity

If traditional single pickup head system is used, then device structure is simple, but chip replacement process is slow resulting in high inspection cost

Engineering Contradiction:
Improvepickup head structureVSAvoidchip replacement speed
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The pickup function is divided into two parallel operations with separate pickup heads, allowing simultaneous defective chip removal and good chip placement. This segmentation enables the system to handle multiple chips in parallel rather than sequentially, significantly increasing chip replacement speed and productivity while keeping each individual pickup head structurally simple.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The dual pickup head system enables continuous chip replacement operation where one pickup head removes defective chips while the other simultaneously places good chips, eliminating idle time between operations. This continuous useful action increases the chip replacement throughput and reduces inspection costs compared to sequential single pickup head operations.

Inventive Principle:
Principle #20Continuity of useful action

Data Source

PatentUS7878336B2System and method for inspection of chips on tray
Publication Date: 2011.02.01 CHENG MEI INSTR TECH CO LTD
  • US7878336B2 patent drawing
  • US7878336B2 patent drawing
  • US7878336B2 patent drawing

AI summary

A system for inspection of chips on a tray comprises an unloading arm device, a first support platform, and a plurality of first tray-handling apparatuses. The first support platform is disposed adjacent to the unloading arm device, movable along a first direction. The plurality of first tray-handling apparatuses are arrayed along the first direction on the first support platform. Each of the plurality of first tray-handling apparatuses provides a particular size of tray for inspection, different from the size of tray provided by other first tray-handling apparatuses, wherein the first platform is configured to move a desired one of the plurality of first tray handling apparatuses before the unloading arm device.