Semiconductor Chip Inspection Wiring With Trench Isolation
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Solution Overview
Problem
Current semiconductor devices face challenges in efficiently integrating inspection wiring structures that effectively surround semiconductor chips while minimizing short circuits and optimizing heat dissipation, particularly in the context of trench separation and connection structures.
Innovation Solution
The semiconductor device incorporates a trench separation structure and inspection wiring design where the inspection wiring is formed in a deep trench isolation style, surrounding the chip with internal and extending wiring portions, and features trench connection structures that connect arched-shaped trench structures to enhance electrical insulation and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inspection wiring is formed surrounding the chip in a conventional manner, then electrical insulation is provided, but short circuits may occur and heat dissipation is inefficient
Solution Approach 1:
The inspection wiring is divided into multiple separate wiring portions (first, second, third, and fourth wiring portions) that are spaced apart from each other. These segmented wiring portions are formed in trenches that extend from the front surface toward the back surface of the semiconductor chip, creating isolated electrical paths that prevent short circuits while maintaining inspection functionality.
Solution Approach 2:
The inspection wiring is extended from the conventional two-dimensional planar configuration into the third dimension by forming trenches that penetrate from the front surface toward the back surface of the chip. This vertical dimensionality change creates insulated wiring paths that are separated by the chip thickness, effectively preventing short circuits between adjacent wiring portions while improving heat dissipation through the trench structures.
2Reliability
If trench separation structure is implemented, then electrical insulation is improved, but device complexity increases
Solution Approach 1:
The trench structures serve multiple functions simultaneously: they provide electrical insulation between adjacent wiring portions, act as physical supports for the inspection wiring, and function as heat dissipation channels. By combining these functions into a single structural element, the design achieves improved reliability without proportionally increasing device complexity.
Solution Approach 2:
The inspection wiring and the trench separation structure are merged into an integrated configuration where the wiring portions are formed within the trenches. This combination eliminates the need for separate insulation layers and wiring structures, simplifying the overall device architecture while maintaining effective electrical insulation.
Data Source
AI summary
A semiconductor device includes a semiconductor chip including a first principal surface in which an element region is formed and a peripheral end surface surrounding the first principal surface and an inspection wiring formed along the peripheral end surface on a side of the first principal surface of the semiconductor chip and that surrounds the element region, and, the inspection wiring includes a plurality of internal wiring portions that are formed at a surficial portion of the first principal surface of the semiconductor chip and that are arrayed at a distance from each other along the peripheral end surface of the semiconductor chip and a extending wiring portion that is formed on the first principal surface of the semiconductor chip and that is provided between the internal wiring portions adjoining each other, and the internal wiring portion and the extending wiring portion are alternately arrayed along the peripheral end surface.