Optoelectronic Chip Interconnect Layout Without Bonding Wires
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Solution Overview
Problem
Existing methods for producing optoelectronic devices, such as LEDs, often require complex and costly processes involving bonding wires and additional insulation layers, which can obstruct radiation emission and increase production complexity.
Innovation Solution
The use of a connecting means, such as a polymer adhesive, to fasten semiconductor chips on a carrier, allowing for electrical contacting via interconnecting tracks that are guided over the edges of the chips, eliminating the need for bonding wires and additional insulation layers, while ensuring reliable electrical connection and radiation transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires and additional insulation layers are used for electrical contacting of semiconductor chips, then reliable electrical connection is achieved, but the device complexity and production cost increase
Solution Approach 1:
The patent removes bonding wires and separate insulation layers from the conventional LED mounting process. Instead, a single connecting means (adhesive layer) performs both mechanical fastening and electrical insulation functions, eliminating unnecessary components and simplifying the production process while maintaining reliable electrical connections between semiconductor chips and circuit board
Solution Approach 2:
The connecting means (adhesive layer) is designed to perform multiple functions simultaneously: mechanical fastening of semiconductor chips to the circuit board, electrical insulation to prevent short circuits, and support for interconnecting tracks. This multi-functional approach replaces the conventional multi-component system (fastening material + insulation layers + bonding wires), reducing device complexity while ensuring reliable electrical connection
2Reliability
If additional insulation layers are added to ensure electrical insulation, then electrical insulation is improved, but the radiation emission is obstructed and transmissivity decreases
Solution Approach 1:
The patent changes the material parameters of the connecting means by selecting radiation-transmissive adhesive materials with appropriate optical properties. The adhesive layer is formulated to have high transmissivity in the visible and UV spectral ranges while maintaining sufficient electrical insulation properties, thus achieving both electrical insulation and radiation emission without the need for additional opaque insulation layers
Solution Approach 2:
The connecting means employs composite material characteristics by combining the electrical insulation properties of polymer adhesives with the radiation transmissivity of optically clear materials. This composite approach allows a single layer to provide both electrical insulation and optical transparency, eliminating the need for separate insulation layers that would obstruct radiation emission
3Reliability
If bonding wires are used for electrical contacting, then electrical connection is established, but the production process becomes more complex and costly
Solution Approach 1:
The patent eliminates bonding wires from the production process by establishing direct electrical contact through interconnecting tracks that extend from the circuit board through the adhesive layer to the contact pads on semiconductor chips. This extraction of the bonding wire component simplifies the production process, reduces material costs, and eliminates the complex wire bonding operation while maintaining reliable electrical connection
Solution Approach 2:
The patent replaces the mechanical bonding wire system with an integrated circuit trace system. Instead of using separate mechanical wires to establish electrical connections, the electrical pathways are formed as conductive tracks within the circuit board structure itself, which are then extended through the adhesive layer to contact the semiconductor chips directly. This substitution simplifies manufacturing by eliminating the wire bonding step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production process, reduces material complexity, and enhances the transparency and reliability of the optoelectronic device by allowing simultaneous electrical contacting and radiation emission without obstructive layers.
Implementation Method 1
The connecting means contains an adhesive, for instance a polymer material such as a silicone or an epoxide
Implementation Method 2
The contact pads are respectively contacted electrically by an interconnecting track
Implementation Method 3
The connecting means may be transmissive for the radiation to be emitted during operation of the optoelectronic device
Data Source
AI summary
In an embodiment an optoelectronic device includes a carrier and a plurality of semiconductor chips fastened on the carrier by a connector, wherein each semiconductor chip has at least one contact pad on a main surface facing away from the carrier, wherein each contact pad is contacted electrically by an interconnecting track, and wherein the interconnecting track is guided over an edge of the main surface of the semiconductor chip onto the carrier.