Semiconductor Chip Interconnection Layout for Heat-Aware Packaging
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Solution Overview
Problem
In semiconductor packages, heat generated by one semiconductor chip is often transferred to adjacent chips, increasing their operational temperature and deteriorating heat dissipation properties and performance.
Innovation Solution
By adjusting the relative position between the interconnection area and the semiconductor chip, a small interconnection interval and increased separation distance between chips are achieved, improving heat dissipation properties and reducing operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If multiple semiconductor chips are disposed adjacent to each other on a substrate, then the communication distance between chips is reduced and the speed of the semiconductor package is increased, but heat generated by one chip is transferred to peripheral chips, increasing their operational temperature and deteriorating heat dissipation properties
Solution Approach 1:
The patent applies asymmetry by positioning the interconnection area at an off-center location on the semiconductor chip, creating unequal distances from the interconnection area to the first edge and second edge. This asymmetric configuration allows optimization of heat dissipation pathways while maintaining electrical connection efficiency, resolving the contradiction between communication speed and heat dissipation.
Solution Approach 2:
The patent implements local quality by creating a specific spatial relationship between the interconnection area and chip edges, where the unequal distances to opposite edges establish localized heat dissipation characteristics. This local structural optimization enables better thermal management in critical areas while maintaining overall package density for high-speed communication.
2Ease of manufacture
If the interconnection area is positioned centrally on the semiconductor chip, then the manufacturing process is simplified, but the separation distance between adjacent chips is reduced and heat dissipation properties are deteriorated
Solution Approach 1:
The patent deliberately introduces asymmetry in the interconnection area positioning, moving it away from the chip center. This asymmetric placement increases the separation distance between adjacent chips, improving heat dissipation properties while maintaining manufacturability through a controlled design approach that accounts for the offset positioning.
3Temperature
If the separation distance between semiconductor chips is increased to improve heat dissipation, then the communication distance between chips is increased and the speed of the semiconductor package is reduced
Solution Approach 1:
The asymmetric positioning of the interconnection area allows the chip to have an optimized form factor where the separation distance between chips is increased for better heat dissipation, while the interconnection area is positioned to maintain efficient electrical pathways. This resolves the contradiction by decoupling the physical separation distance from the electrical connection efficiency through strategic placement.
Data Source
AI summary
A semiconductor package according to an embodiment includes a connection substrate, a first semiconductor chip, and a second semiconductor chip. The first semiconductor chip is disposed on the connection substrate and includes a first interconnection area facing the connection substrate. The second semiconductor chip is disposed on the connection substrate and includes a second interconnection area facing the connection substrate. The second semiconductor chip includes a first edge adjacent to the first semiconductor chip and a second edge opposite to the first edge in a first direction. A first distance between the second interconnection area and the first edge in the first direction is different from a second distance between the second interconnection area and the second edge in the first direction.