Semiconductor Package Interposer Structure with Passive Warpage Buffer
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving reliable electrical connections and preventing warpage between stacked packages, particularly when using interposers.
Innovation Solution
The introduction of a passive element between the interposer and the semiconductor chip enhances product reliability by facilitating improved electrical connections and structural support, thereby inhibiting warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer is used to facilitate electrical connections between stacked packages, then electrical connectivity is improved, but warpage of the packages may occur
Solution Approach 1:
A passive element is introduced as an intermediary component between the interposer and the semiconductor chip. This passive element acts as a mediator that distributes mechanical stress and prevents direct transmission of warpage forces, thereby maintaining both electrical connection reliability and package stability simultaneously
2Adaptability or versatility
If multiple semiconductor chips are stacked on a single package substrate, then functionality and operating speeds are increased, but structural stability and warpage control become more difficult
Solution Approach 1:
The passive element serves as a stress-distributing intermediary in the stacked package configuration, allowing multiple chips to be integrated while maintaining structural stability by preventing warpage propagation through the stack
Solution Approach 2:
The passive element is constructed from composite materials with optimized mechanical properties, combining different materials to achieve both electrical performance and mechanical stability in the multi-chip stacked configuration
Data Source
AI summary
A semiconductor package includes; a substrate including a first insulating layer and a first conductive pattern in the first insulating layer, a first semiconductor chip on the substrate, an interposer spaced apart from the first semiconductor chip in a direction perpendicular to an upper surface of the substrate and including a second insulating layer and a second conductive pattern in the second insulating layer, a first element between the first semiconductor chip and the interposer, a connection member between the substrate and the interposer, and a mold layer covering side surfaces of the first semiconductor chip and side surfaces of the first element.