Chip Package Lid With Corner Supports for Thermal Stress Relief
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Solution Overview
Problem
New packaging technologies for semiconductor dies face manufacturing challenges, particularly in managing thermal stress and warpage due to coefficient of thermal expansion mismatches, which can lead to delamination and reduced reliability and performance of chip packages.
Innovation Solution
A chip package design that includes a substrate with a semiconductor die and a lid secured to both the die and the substrate, featuring support structures and openings between them to reduce thermal stress and prevent warpage, enhancing structural integrity and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a lid is added to protect the semiconductor die and provide structural support, then reliability and protection are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The lid is integrated with support structures that are bonded to the substrate, creating a nested configuration where the lid encompasses the semiconductor die and the support structures provide internal reinforcement. This nesting approach provides comprehensive protection while consolidating multiple functions into a unified structure.
Solution Approach 2:
The lid is designed with openings that segment the continuous structure, allowing for stress relief and thermal management while maintaining overall protection. The support structures are also segmented and positioned at specific locations to provide targeted reinforcement without requiring complete coverage.
2Reliability
If support structures are added to reduce thermal stress, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The support structures are pre-formed and positioned on the substrate before the lid is attached. This preliminary placement allows for precise positioning and bonding to the substrate, establishing a stable foundation that reduces thermal stress without requiring high-precision alignment during the final lid attachment step.
Solution Approach 2:
The support structures act as intermediary elements between the substrate and the lid, providing a transition zone that manages thermal stress. These intermediaries are bonded to both the substrate and the lid, distributing stresses and reducing the precision requirements for direct substrate-lid bonding.
3Reliability
If openings are created in the lid to reduce thermal stress, then reliability is improved, but structural strength may be reduced
Solution Approach 1:
The lid is segmented by creating openings that divide the continuous structure into distinct regions. This segmentation allows for stress relief by preventing stress accumulation across the entire lid surface, while the remaining material maintains sufficient structural strength through strategic placement of the openings.
Solution Approach 2:
The lid exhibits local quality variations where material is present in some regions and absent in others. The openings are positioned to relieve stress in specific high-stress areas while maintaining material presence in regions requiring structural support, optimizing the balance between stress management and strength.
4Stability of the object's composition
If the lid is secured to both the die and substrate, then structural integrity is improved, but manufacturing complexity increases
Solution Approach 1:
The bonding process is merged into a single integrated operation where the lid is simultaneously bonded to both the semiconductor die and the substrate. This combining of bonding targets into one process step establishes structural integrity while reducing the number of separate bonding operations required.
Solution Approach 2:
The support structures serve as intermediary bonding elements that facilitate the connection between the lid and the substrate. By bonding to these intermediaries first, the lid achieves stable attachment to the substrate-lid assembly, simplifying the overall bonding process while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces delamination and warpage, improving the reliability and performance of the chip package by managing thermal stress and maintaining structural integrity through the use of a lid with support structures and openings.
Implementation Method 1
managing thermal stress and warpage due to coefficient of thermal expansion mismatches
Implementation Method 2
enhancing structural integrity and heat dissipation
Data Source
AI summary
A chip package is provided. The chip package includes a substrate and a semiconductor chip over the substrate. The chip package also includes an upper plate extending across edges of the semiconductor chip. The chip package further includes a first support structure connecting a first corner portion of the substrate and a first corner of the upper plate. In addition, the chip package includes a second support structure connecting a second corner portion of the substrate and a second corner of the upper plate. The upper plate has a side edge connecting the first support structure and the second support structure, and the side edge extends across opposite edges of the semiconductor chip.