Chip Package Lid Structure for Local Hot Spot Dissipation
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Solution Overview
Problem
Integrated chips generate uneven heat distribution, leading to local hot spots that can cause performance degradation, reliability issues, and chip failure due to inefficient heat dissipation.
Innovation Solution
A chip package structure with a heat dissipation lid and protruding portions that extend into the semiconductor substrate to directly address local hot spots, utilizing heat conductive plugs and layers with higher thermal conductivity to efficiently dissipate heat from these regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation structures are used, then the overall chip temperature may be controlled, but local hot spots cannot be effectively addressed leading to performance degradation and reliability issues
Solution Approach 1:
The patent applies local quality by creating protruding portions of the heat dissipation lid that extend into recesses of the substrate directly over hot spot regions. This localized structural modification concentrates heat dissipation capacity precisely where needed, addressing the technical contradiction by enabling targeted thermal management at hot spots while maintaining overall chip temperature control through the lid's plate portion.
Solution Approach 2:
The heat dissipation lid is segmented into a plate portion and multiple protruding portions, each serving distinct thermal management functions. The plate portion provides overall heat dissipation coverage, while the protruding portions specifically address local hot spots. This segmentation allows the system to simultaneously manage both global and local thermal conditions, resolving the contradiction between overall temperature control and localized hot spot mitigation.
2Ease of manufacture
If the chip structure is simplified, then manufacturing becomes easier, but heat dissipation effectiveness is reduced
Solution Approach 1:
The substrate is pre-formed with recesses at the locations where hot spots will occur, before the heat dissipation lid is attached. This preliminary action simplifies manufacturing by allowing the lid to be a simpler component that merely needs to fit into the pre-prepared recesses, rather than requiring complex integrated heat dissipation structures. The recesses are created during substrate fabrication, and the lid is subsequently bonded in place, maintaining manufacturing simplicity while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively dissipates heat from local hot spots, improving chip performance and reliability by enhancing heat conduction and reducing the risk of failure.
Implementation Method 1
heat conductive plugs and layers with higher thermal conductivity to efficiently dissipate heat from these regions
Data Source
AI summary
A chip package structure is provided. The chip package structure includes a carrier substrate. The chip package structure includes a chip structure over the carrier substrate. The chip structure includes a semiconductor substrate and a device layer, the semiconductor substrate has a front surface and a back surface opposite to the front surface, the front surface faces the carrier substrate, and the device layer is between the front surface and the carrier substrate. The chip package structure includes a heat dissipation lid over the back surface of the semiconductor substrate. The heat dissipation lid has a plate portion and a first protruding portion under the plate portion, and the first protruding portion extends into the semiconductor substrate from the back surface.