Chip Package Lid Openings for Warpage and Delamination Control

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Solution Overview

Problem

New packaging technologies for semiconductor dies face manufacturing challenges related to warpage and delamination due to thermal stress, which affect the reliability and performance of chip packages.

Innovation Solution

A chip package design that includes a lid bonded to the semiconductor die and substrate, featuring support structures and openings between them, which acts as a stiffener and heat sink to reduce thermal stress and warpage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If new packaging technologies are used to improve density and functions of semiconductor dies, then functional density is improved, but manufacturing challenges related to warpage and delamination occur due to thermal stress

Engineering Contradiction:

Improvefunctional densityVSAvoidwarpage and delamination

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The lid is segmented into multiple regions including solid portions and opening portions (through-holes). This segmentation allows different areas of the lid to serve different functions: solid portions provide structural support and stiffening, while opening portions allow thermal stress to pass through, preventing warpage and delamination of the underlying substrate and semiconductor die.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The lid incorporates opening portions (through-holes) that create a porous-like structure. These openings allow thermal stress to pass through the lid rather than accumulating, thereby reducing warpage and delamination while still maintaining the lid's structural support function. The lid effectively acts as a semi-porous structure that filters mechanical stress.

Inventive Principle:

Principle #31Porous materials

2Strength

If a lid is added to protect semiconductor devices and provide stiffening, then protection and structural support are improved, but thermal stress accumulation occurs leading to warpage and delamination

Engineering Contradiction:

Improvestructural supportVSAvoidthermal stress

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The lid is divided into solid portions and opening portions. The solid portions maintain structural strength and provide stiffening, while the opening portions allow thermal stress to pass through. This segmentation resolves the contradiction by spatially separating the structural support function from the thermal stress management function.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The opening portions in the lid convert the harmful effect of thermal stress into a beneficial outcome. Instead of blocking thermal stress entirely (which would cause warpage), the openings allow controlled passage of thermal stress, transforming it from a harmful force into a mechanism that prevents delamination and warpage while maintaining overall structural integrity.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Strength

If the lid is made solid to maximize stiffening effect, then structural support is improved, but thermal stress management deteriorates causing warpage

Engineering Contradiction:

ImprovestiffeningVSAvoidwarpage

Core Design Contradiction:

StrengthVSStability of the object's composition

Solution Approach 1:

The lid is segmented into solid portions that provide stiffening and opening portions that manage thermal stress. This segmentation allows the lid to simultaneously achieve both stiffening and warpage prevention, resolving the contradiction between structural strength and compositional stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the lid have different properties: solid portions have high structural quality for stiffening, while opening portions have high thermal stress transmission quality. This local differentiation of properties allows the lid to perform multiple functions simultaneously without compromise.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design significantly reduces delamination and warpage of the chip package, improving its reliability and performance by effectively managing thermal stress through the use of openings in the lid.

Implementation Method 1

Methodology Applied

Scientific EffectHeat sink: Heat Sink

Data Source

PatentUS12300632B2Chip package with lid

Publication Date: 2025.05.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A chip package includes a substrate, a semiconductor chip, and a thermal conductive structure. The chip package includes a first and a second support structures below the thermal conductive structure. The first and the second support structures connect the substrate and corners of the thermal conductive structure. The thermal conductive structure has a side edge connecting the first and the second support structures. The first and the second support structures and the side edge together define of an opening exposing a space surrounding the semiconductor chip. The first and the second support structures are disposed along a side of the substrate. The first support structure is laterally separated from the side of the substrate by a first lateral distance. The side edge of the thermal conductive structure is laterally separated from the side of the substrate by a second lateral distance different than the first lateral distance.