Chip Electronic Component Magnetic Layer Plating Inductance
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Solution Overview
Problem
The miniaturization of chip electronic components has led to decreased inductance and quality factor due to reduced volume of magnetic material and coil turns, with conventional efforts to improve permeability using high magnetic materials being ineffective in achieving target inductance and quality factor.
Innovation Solution
A chip electronic component with a magnetic body and a high permeability magnetic layer formed by plating processing, where the magnetic layer includes metals or alloys like iron, silicon, and copper, is embedded with a coil part and covered by an insulating layer, increasing permeability without increasing the magnetic material's permeability, thereby enhancing inductance and quality factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the volume of magnetic material is decreased for miniaturization, then the size of chip electronic component is reduced, but inductance deteriorates
Solution Approach 1:
The patent applies local quality by forming a magnetic layer with high permeability specifically at the position corresponding to the coil part, rather than uniformly increasing magnetic material throughout the entire component. This localized approach concentrates magnetic flux where it is most needed for inductance generation, achieving improved inductance with minimal increase in overall component volume.
Solution Approach 2:
The patent uses composite materials by combining a magnetic body containing magnetic powder particles with a separately formed magnetic layer. The magnetic layer is formed by plating processing using metal or alloy materials (such as iron, nickel, or their alloys) that exhibit high permeability, creating a composite structure that enhances inductance without proportionally increasing the volume of magnetic material in the magnetic body.
2Volume of moving object
If the number of turns of coil part is decreased for miniaturization, then the size of chip electronic component is reduced, but quality factor deteriorates
Solution Approach 1:
The magnetic layer is formed locally at the position corresponding to the coil part to concentrate magnetic flux in the region most critical for inductance and quality factor. This localized enhancement compensates for the reduced number of coil turns by improving the magnetic coupling efficiency in the remaining turns.
Solution Approach 2:
The patent changes the permeability parameter by introducing a magnetic layer with high permeability (μr≥100) at the coil position. This parameter change enhances the magnetic flux density and coupling coefficient, thereby improving quality factor even when the number of coil turns is reduced for miniaturization.
3Quantity of substance
If conventional magnetic materials with high permeability are used, then inductance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces the conventional mechanical approach of mixing high-permeability magnetic powder into the magnetic body with a plating-based formation method for the magnetic layer. This substitution simplifies manufacturing by using established plating processes rather than requiring complex material mixing and formulation procedures.
Solution Approach 2:
Instead of changing the material composition parameter of the entire magnetic body (which would require complex formulation), the patent changes the permeability parameter locally by forming a magnetic layer through plating. This approach maintains simple magnetic body manufacturing while achieving high inductance through the plated layer.
4Quantity of substance
If a magnetic layer is formed by plating processing, then permeability is increased without increasing magnetic material volume, but manufacturing process complexity increases
Solution Approach 1:
The plating process serves multiple functions: it forms the magnetic layer with high permeability, provides corrosion protection, and can serve as a seed layer for subsequent plating steps. This multi-functionality justifies the added process step by achieving several objectives simultaneously rather than requiring separate operations for each function.
Solution Approach 2:
The plating process enables precise control of the magnetic layer thickness and composition parameters, allowing optimization of permeability without proportionally increasing volume. By controlling plating thickness and metal composition, the manufacturing process achieves targeted permeability enhancement while maintaining compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases inductance and quality factor by forming a high permeability magnetic layer near the coil part on the insulating layer, preventing short-circuit defects and maintaining efficiency under high frequency and current conditions.
Implementation Method 1
The magnetic layer may be formed by a plating processing
Data Source
AI summary
Chip electronic component and manufacturing method thereof disclosed. An example aspect provides a chip electronic component. The chip electronic component includes a magnetic body including a magnetic material, a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor, an insulating layer covering the first coil conductor and the second coil conductor, and a magnetic layer formed on the insulating layer.