Semiconductor Chip Marking Using Collapsible Recognition Patterns
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Solution Overview
Problem
Existing methods for marking semiconductor chips, such as those disclosed in PTL 1, suffer from nonuniformity in scratch marks due to the abrasion state of the probe needle and surface state of the semiconductor substrate, leading to difficulty in recognizing the marking, especially when the shape change between before and after marking is minimal.
Innovation Solution
The methods involve forming recognition patterns or recess portions on the semiconductor substrate and using a probe needle to create markings by causing the patterns to fall, push the edges of recesses, open holes in lid portions, or detach bridge piers, resulting in significant shape changes that enhance recognition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a probe needle is used to shave the surface of a semiconductor substrate to create a scratch mark, then marking is performed on defective chips, but nonuniformity of shapes of the scratch mark occurs due to abrasion state of the probe needle or surface state of the substrate
Solution Approach 1:
A recognition pattern protruding from the surface is formed in advance on the semiconductor substrate before the marking process. This preliminary structure ensures that when the probe needle pushes it, the pattern falls consistently, creating a uniform marking shape regardless of probe needle abrasion or substrate surface variations.
Solution Approach 2:
The invention changes the marking mechanism from direct surface shaving to pushing a protruding recognition pattern that falls. This parameter change in the marking process ensures that the shape of the marking is determined by the pattern's geometry rather than by variable factors like probe needle condition or substrate surface state.
2Ease of manufacture
If a scratch mark is made by shaving the surface, then marking is performed, but the scratch mark becomes thin or shallow when nonuniformity occurs
Solution Approach 1:
A recognition pattern with a specific geometric shape protruding from the surface is formed in advance. When this pattern falls due to probe needle pushing, it creates a marking with significant shape change that is easily recognizable, eliminating the thin or shallow mark problem.
Solution Approach 2:
The recognition pattern is designed with asymmetric or distinctive geometric features that create a clear shape change when fallen. This asymmetry ensures the marking is visually distinct and easily recognizable, solving the detection difficulty.
3Ease of manufacture
If the shape change in a marking part between times before and after marking is small, then marking is performed, but recognition of the scratch mark becomes difficult
Solution Approach 1:
A recognition pattern protruding from the surface is formed in advance with a geometry designed to create significant shape change when fallen. This ensures the marking retains clear recognition information, preventing loss of marking identifiability.
Solution Approach 2:
The invention utilizes the vertical dimension by creating a protruding pattern that falls from a raised position to a lowered position. This dimensional change creates a significant shape difference between before and after marking, ensuring the marking information remains clearly recognizable.
Data Source
AI summary
In a method for marking a semiconductor chip (10), the semiconductor chip (10) including a semiconductor substrate (12), in the semiconductor chip (10), a recognition pattern (18) protruding from a surface (14) is formed on the surface (14) of the semiconductor substrate (12), and marking is performed by causing the recognition pattern (18) to fall by a probe needle (20).