Chip Module Backside Conductive Elements Light Attack Detection
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Solution Overview
Problem
Existing chip modules are vulnerable to light attacks, such as electromagnetic radiation, which can compromise the security of stored data by allowing unauthorized access to cryptographic keys, and existing protection methods require complex adaptations to the chip production process.
Innovation Solution
A chip module with a module carrier featuring electrically conductive elements, such as conductive layers, conductor tracks, coils, or resistors, applied to the underside, which form an electrical circuit with the chip, allowing for detection of attacks through changes in electrical properties without modifying the chip production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If light sensors or optical gratings are applied to the front of the chip to protect against light attacks, then protection against light attacks is improved, but device complexity increases
Solution Approach 1:
Instead of placing protective elements on the front of the chip, the patent applies electrically conductive elements on the back of the chip module. This inverted approach protects against light attacks by detecting changes in electrical parameters caused by laser-induced damage, avoiding the complexity of front-side protective measures while maintaining security.
2Reliability
If electrically conductive elements are applied to the module carrier, then protection against attacks is improved, but manufacturing complexity increases
Solution Approach 1:
The protective function is segmented from the chip itself and implemented on the module carrier. This allows the protective electrically conductive elements to be applied separately during module assembly rather than requiring modifications to the chip manufacturing process, thereby improving ease of manufacture while maintaining protection effectiveness.
3Ease of operation
If additional contact pads are placed on both the chip and module carrier to establish electrical connection, then electrical connection is improved, but device complexity increases
Solution Approach 1:
The patent extracts the electrical connection function from multiple contact pads and implements it through existing contact fields on the module carrier. The electrically conductive elements are connected to these existing contact fields, eliminating the need for additional contact pads on both chip and carrier, thereby reducing device complexity while maintaining electrical connection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides efficient protection against light attacks by detecting damage to the module carrier through changes in electrical parameters, enabling countermeasures like deleting confidential information without altering the chip manufacturing process.
Implementation Method 1
electrically conductive elements are provided on the first side of the module carrier, which form an electrical circuit with the chip
Implementation Method 2
The ground potential contact field, the electrically conductive surface, and the electrically insulating material of the module carrier between them form a capacitor in the electrical circuit connected to the chip
Implementation Method 3
at least one electrically conductive element is designed as a coil on the first side of the module carrier
Data Source
Figure 1~3
AI summary
The invention relates to a chip module, comprising an electrically insulating module carrier (3) having a first side and a second side and also electrically insulating material between the first and second sides, wherein the first side holds a chip (2) and the second side has an arrangement (1) comprising one or more electrically conductive contact areas (101, 102,..., 108) formed on it to which at least some of the chip (2) is connected. The chip module according to the invention is distinguished in that the first side of the module carrier (3) holds one or more electrically conductive elements (4) which are connected to the chip (2) to form an electric circuit.