Chip Module Carrier With Diffusion Barrier
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Solution Overview
Problem
Current chip module fabrication methods face challenges in effectively connecting semiconductor chips with contact elements to carriers, particularly in ensuring reliable electrical contact and preventing diffusion of solder materials, which can lead to inter-metallic phase formation and reduced reliability.
Innovation Solution
The solution involves using a carrier made of conductive materials like copper or iron/nickel alloys, connected to semiconductor chips via re-flow soldering or conductive adhesives, with a diffusion barrier like a titanium layer to prevent solder diffusion, and forming electrical connectors and insulation layers to facilitate secure and reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If re-flow soldering is used to connect semiconductor chips to carriers, then electrical connection reliability is improved, but solder material diffusion occurs causing inter-metallic phase formation
Solution Approach 1:
A diffusion barrier layer is introduced as an intermediary between the carrier and the semiconductor chip. This barrier layer prevents solder material from diffusing into the carrier during re-flow soldering, thereby eliminating inter-metallic phase formation while maintaining reliable electrical connections.
Solution Approach 2:
The carrier structure employs composite material design with a diffusion barrier layer integrated into the carrier substrate. This composite structure combines the electrical conductivity of the carrier material with the diffusion-blocking properties of the barrier layer, achieving both reliable connection and prevention of harmful diffusion.
2Adaptability or versatility
If contact elements are arranged on both main surfaces of semiconductor chips, then connection versatility is improved, but manufacturing complexity increases
Solution Approach 1:
The semiconductor chip is segmented into two functional surfaces: a first main surface with contact elements for carrier connection and a second main surface with contact elements for PCB connection. This segmentation allows each surface to be optimized for its specific connection purpose, achieving versatility while managing manufacturing complexity through clear functional division.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of chip module connections by preventing solder diffusion and ensuring stable electrical contacts, allowing for efficient integration with printed circuit boards while maintaining the integrity of the semiconductor chip and carrier interface.
Implementation Method 1
a diffusion barrier like a titanium layer to prevent solder diffusion
Implementation Method 2
connected to semiconductor chips via re-flow soldering
Implementation Method 3
connected to semiconductor chips via re-flow soldering or conductive adhesives
Data Source
AI summary
The chip module includes a semiconductor chip having a first contact element on a first main face and a second contact element on a second main face. The semiconductor chip is arranged on a corner in such a way that the first main face of the semiconductor chip faces the carrier. One or more electrical connectors are connected to the carrier and include end faces located in a plane above a plane of the second main face of the semiconductor chip.