Chip Module Carrier Segmentation for High Resolution LED Displays
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Solution Overview
Problem
Current methods for producing chip modules using packaged LED components are limited in terms of proximity and flexibility, making it difficult to achieve high video resolution and homogeneous illumination in a compact form.
Innovation Solution
The method involves arranging unpackaged semiconductor chips on a carrier, applying an electrically insulating material, and structuring the carrier to create separate sections connected by the insulating material, allowing for independent operation and flexible mounting of chip components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If packaged LED components are used, then ease of manufacture is improved, but device area and resolution are limited
Solution Approach 1:
The patent segments the LED display into individual chip-level components rather than using packaged LED modules. Each semiconductor chip is mounted directly on the carrier in a grid pattern, dividing the display area into smaller, more densely packed units. This segmentation enables higher resolution within a compact area while maintaining manufacturing feasibility through automated chip mounting processes.
2Ease of manufacture
If packaged LED components are used, then ease of manufacture is improved, but manufacturing precision and resolution are worsened
Solution Approach 1:
The patent applies preliminary actions by pre-arranging the semiconductor chips in the desired grid pattern on the carrier before final assembly. The carrier structure is pre-configured with contact pads and conductive traces that align with the chip positions, enabling precise placement. This preliminary arrangement ensures high manufacturing precision while maintaining ease of manufacture through standardized mounting procedures.
3Adaptability or versatility
If carrier sections are structured separately, then adaptability and flexibility are improved, but device complexity increases
Solution Approach 1:
The carrier is divided into multiple separate carrier sections, each capable of independent operation and mounting. These segmented sections can be arranged in various configurations to create different display shapes and sizes, including curved surfaces. The segmentation provides adaptability for diverse applications while the modular nature simplifies the overall system architecture by creating reusable, standardized units.
Solution Approach 2:
Each carrier section is designed as a universal module that can serve multiple functions: it can be mounted on flat or curved surfaces, configured in different geometric arrangements, and independently controlled. This multi-functionality increases adaptability across various applications without proportionally increasing device complexity, as the same basic module design is reused in different configurations.
Data Source
AI summary
A method of producing a chip module includes providing a carrier; arranging semiconductor chips on the carrier; applying an electrically insulating material on the carrier; and structuring the carrier such that the chip module is provided, wherein the chip module includes separate carrier sections produced by structuring the carrier, the carrier sections of the chip module connected by the electrically insulating material.