Chip Module Conductive Adhesive Contact Layer

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Solution Overview

Problem

Existing chip modules face challenges in achieving a stable mechanical and electrical connection between the chip and the chip carrier, particularly in ensuring adhesive strength and reliable electrical conductivity on the rear side of semiconductor components.

Innovation Solution

A chip module design featuring a contact layer with multiple electrically insulated regions on the chip carrier, connected via an electrically conductive adhesive, which provides independent electrical connections and mechanical stability, and optionally includes a housing for protection and solder balls for thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal sandwich layer with final gold surface is used for metallization, then electrical conductivity is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveelectrical conductivityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the essential function of electrical conductivity from the complex multi-layer metal sandwich structure and implements it through a simpler single-layer conductive adhesive application, eliminating unnecessary manufacturing steps while maintaining electrical performance

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the material parameter from traditional metal layers to conductive adhesive, and changes the application method from vacuum deposition to screen printing or dispensing, thereby simplifying the manufacturing process while achieving the required electrical conductivity

Inventive Principle:

Principle #35Parameter changes

2Strength

If adhesive connection is used to mount chip to carrier, then mechanical connection is established, but electrical conductivity reliability deteriorates

Engineering Contradiction:

Improveadhesive strengthVSAvoidelectrical connection stability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent uses composite materials by combining adhesive properties and electrical conductivity in a single conductive adhesive material, allowing simultaneous achievement of mechanical bonding and electrical connection without compromising either function

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent merges the mechanical bonding function and electrical conduction function into a single integrated solution - the conductive adhesive layer performs both adhesive bonding between chip and carrier and electrical connection between their contact surfaces

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If soldered or sintered connection is used, then electrical conductivity is improved, but manufacturing complexity and reliability risks increase

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces expensive and complex soldering/sintering processes with a simpler, more cost-effective conductive adhesive application process, achieving reliable electrical connections without requiring high-temperature processing or specialized equipment

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent substitutes the mechanical/thermal processes of soldering and sintering with a chemical bonding process using conductive adhesive, eliminating the need for high-temperature equipment and complex process control while maintaining connection reliability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the stability and reliability of the chip-carrier connection, allowing for efficient electrical contact and mechanical strength, while enabling continuous monitoring and detection of potential defects through a test method using a test arrangement.

Implementation Method 1

an electrically conductive adhesive arranged on an upper side of the contact layer facing the chip. The electrically conductive adhesive connects the upper side of the contact layer and the rear side of the chip

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

The combination of these two functions creates high demands on the adhesive connection or soldered or sintered connection

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20220181247A1Chip Module, Use of Chip Module, Test Arrangement and Test Method

Publication Date: 2022.06.09 FIRST SENSOR

AI summary

A chip module includes a chip having a front side and a rear side, a chip carrier having an upper side facing the chip, a contact layer formed of an electrically conductive material and arranged on the upper side of the chip carrier between the rear side of the chip and the upper side of the chip carrier, and an electrically conductive adhesive arranged on an upper side of the contact layer facing the chip. The electrically conductive adhesive connects the upper side of the contact layer and the rear side of the chip. The contact layer has a plurality of regions electrically insulated from each other and each electrically connected to the chip by the electrically conductive adhesive.