Chip Module Folding Structure for Reliable Fastening
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Solution Overview
Problem
The existing methods for installing chip modules in electronic inhalation apparatuses, such as E-cigarettes, face challenges with incomplete UV-curing adhesives leading to unreliable bonding and increased complexity, which affects cost-effectiveness and throughput.
Innovation Solution
The use of a folding structure within the chip module accommodating region that can be bent around the chip module to fasten it securely, potentially eliminating the need for additional adhesives and ensuring reliable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If UV-curing adhesive is used to firmly stick the chip module to the apparatus body, then high throughput is achieved and thermal load is low, but the adhesive may not cure completely if not fully reached by UV light, leading to unreliable bonding
Solution Approach 1:
The patent extracts the adhesive application step from the chip module assembly process. Instead of applying adhesive to the chip module and relying on UV curing, the chip module is inserted into a recess in the apparatus body where it is retained by the structural geometry of the recess and cover, eliminating the adhesive layer entirely.
Solution Approach 2:
The patent introduces a cover component as an intermediary element. The cover works in conjunction with the recess to create a mechanical retention system. The cover engages with the chip module and the recess structure to secure the chip module in place without requiring adhesive bonding.
2Productivity
If UV-curing adhesive is used to firmly stick the chip module to the apparatus body, then high throughput is achieved, but additional complex procedures are needed to ensure reliable adhesive bonding
Solution Approach 1:
The patent removes the adhesive application process, UV light source, and curing monitoring steps from the assembly process. The chip module is simply inserted into the recess and secured by the mechanical structure, significantly simplifying the manufacturing process while maintaining high throughput.
Solution Approach 2:
The recess and cover structure provides self-retention for the chip module. The geometric design of the recess and the corresponding cover features automatically secure the chip module in place through mechanical interference, eliminating the need for external adhesive bonding processes.
3Device complexity
If a folding structure is used to fasten the chip module, then additional fastening materials can be eliminated, but the structure must be precisely formed to ensure reliable fastening
Solution Approach 1:
The patent merges the fastening function into the existing recess and cover structure. The folding structure is integrated as part of the cover assembly, combining the retention and fastening functions into a single structural element rather than adding separate fastening components.
Solution Approach 2:
The recess and cover structure are pre-formed with precise geometric features during the molding process. The folding structure is designed into the mold tooling, ensuring consistent precision in each manufactured unit without requiring post-processing or complex assembly steps.
Data Source
AI summary
An electronic inhalation apparatus including a body having a chip module accommodating region which is at least partially surrounded by a folding structure which, when a chip module is accommodated in the chip module accommodating region, is bent around the chip module in order to fasten the chip module, wherein the folding structure has a folding region on at least one side of the chip module accommodating region extending a length that is less than a length of the respective side of the chip module accommodating region.