Insulation Layer for Chip Modules with Low Thermal-Dielectric Product
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Solution Overview
Problem
Chip modules face challenges in balancing thermal conductance and electrical capacitance of insulation layers, leading to increased dynamic current losses and electromagnetic interferences, which affect power efficiency and heat generation.
Innovation Solution
Selecting insulation materials with specific dielectric constants and thermal conductivities, such as silicon dioxide or metal oxides, to satisfy the condition λ·∈r < 4.0 W·m−1·K−1, and using porous materials with high porosity to optimize thermal resistance while minimizing electrical capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thermal conductance of the insulation layer is increased to improve heat transfer, then the electrical capacitance also increases, leading to increased dynamic current losses and electromagnetic interferences
Solution Approach 1:
The patent changes the material parameters of the insulation layer by selecting materials with specific dielectric constants and thermal conductivities that satisfy the condition λ·∈r < 4.0 W·m−1·K−1. This parameter optimization allows the insulation layer to achieve good heat transfer while maintaining low electrical capacitance, thereby resolving the contradiction between thermal conductance and energy loss
Solution Approach 2:
The patent employs composite insulation structures including porous materials and specific material combinations (such as silicon dioxide or metal oxides) that provide both high thermal conductance and low electrical capacitance. These composite materials enable simultaneous optimization of thermal and electrical properties, addressing the contradiction between heat transfer and dynamic current losses
2Temperature
If the thermal conductance of the insulation layer is increased to improve heat transfer, then the electrical capacitance increases, leading to electromagnetic interferences
Solution Approach 1:
The patent optimizes the material parameters by selecting insulation materials with specific dielectric constants and thermal conductivities satisfying λ·∈r < 4.0 W·m−1·K−1. This parameter control reduces electrical capacitance while maintaining thermal performance, thereby minimizing electromagnetic interferences
Solution Approach 2:
The patent uses porous materials with high porosity that provide effective insulation with reduced material density and lower electrical capacitance. These materials achieve good thermal management while minimizing electromagnetic interference effects
3Loss of energy
If porous materials with high porosity are used to reduce electrical capacitance, then the thermal resistance increases, affecting heat transfer
Solution Approach 1:
The patent carefully controls the porosity parameter of the insulation material to achieve an optimal balance. By selecting specific porosity ranges and material compositions, the patent reduces electrical capacitance while maintaining sufficient thermal conductance for effective heat transfer
Solution Approach 2:
The patent uses composite structures combining porous materials with other materials to compensate for the thermal resistance increase. This composite approach maintains low electrical capacitance through porosity while ensuring adequate heat transfer through the composite structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat transfer while reducing power losses and electromagnetic interferences, improving the overall efficiency and reliability of chip modules by controlling thermal and electrical properties of the insulation layers.
Implementation Method 1
a heat conducting insulation layer may be provided to convey the heat to, for example, a heat sink
Implementation Method 2
the dielectric constant ∈r and the thermal conductivity λ of the insulation layer satisfy the condition: λ·∈r < 4.0 W·m−1·K−1
Data Source
AI summary
The chip module includes a carrier, a semiconductor chip arranged on or embedded inside the carrier, and an insulation layer that at least partly covers a face of the carrier. The dielectric constant ∈r and the thermal conductivity λ of the insulation layer satisfy the condition λ·∈r<4.0 W·m−1·K−1.