Chip Module Laser Welding via Transparent Carrier Window
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Solution Overview
Problem
Conventional methods for producing portable data carriers with chip modules expose the chip to thermal stress and result in a flexible, detachable connection between the chip module and the card body, which is not hardened.
Innovation Solution
A chip module with a carrier having regions transparent and non-transparent to laser light is used, where the chip is electrically connected to conductive contacts, and a laser is employed to create a permanent, non-detachable connection by welding the chip module to the card body, reducing thermal stress and enhancing mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat-activatable adhesive and pressure-heat curing methods are used to connect the chip module to the card body, then the connection can be established, but the chip is exposed to thermal stress and the connection remains flexible and detachable rather than hardened
Solution Approach 1:
The patent replaces the thermal curing process with a mechanical cold welding process. The chip module is pressed against the card body with sufficient force to create a direct mechanical bond between the adhesive and the surfaces, eliminating the need for heat activation and thus protecting the chip from thermal stress while achieving a hardened, non-detachable connection
Solution Approach 2:
The patent changes the curing parameter from thermal activation to mechanical pressure activation. By applying controlled mechanical pressure to the adhesive layer, the bonding process occurs at room temperature, transforming the curing mechanism from thermal to mechanical while maintaining connection reliability
2Productivity
If conventional lamination using pressure and heat is used to create the connection, then the connection can be formed, but the production speed is reduced and thermal load on the chip increases
Solution Approach 1:
The patent replaces the thermal lamination process with a cold mechanical pressing process. The chip module is pressed against the card body without heat activation, eliminating the time-consuming thermal cycling while reducing thermal load on the chip, thereby increasing production speed
3Reliability
If a uniform opaque carrier is used to protect the chip, then mechanical protection is provided, but laser welding cannot penetrate the carrier to create a permanent connection
Solution Approach 1:
The patent applies local quality by creating a transparent window in the carrier material at the specific location where laser welding is required. The carrier remains opaque in other areas to provide mechanical protection, while the local transparent region allows laser penetration for creating a permanent welded connection between the chip module and card body
Solution Approach 2:
The patent segments the carrier into different functional regions: opaque protective areas and a transparent welding window area. This segmentation allows the carrier to simultaneously provide mechanical protection and enable laser welding at the specific location where the adhesive bond is formed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for faster production of portable data carriers with a robust, non-detachable connection between the chip module and card body, minimizing thermal stress on the chip and improving mechanical resilience.
Implementation Method 1
at least one laser beam of at least one laser penetrating the area of the chip module that is permeable to laser light and permanently connecting the chip module to the card body at one point, e.g. welded where the area of the chip module that is permeable to laser light and the card body touch
Implementation Method 2
the card body having a laser light-absorbing property at least at the point where chip card and card body touch
Data Source
Figure 1~2
Figure 3~4
AI summary
The present invention discloses a chip module (2), which is inserted into a card body (14) of a portable data carrier (22) and is permanently connected to it, wherein the module (2) comprises a substrate (4), wherein at least one electrically conductive contact (10) is arranged on one side of the substrate (4), wherein at least one chip (12) is arranged on another side of the substrate (4), which side is arranged opposite to the side on which the at least one contact (10) is arranged, wherein the chip (12) has at least one connection (10) which is electrically conductively connected to at least one contact (10), characterized in that the substrate (4) has at least one first area (6) which is permeable to laser light, and has at least one second area (8) which is impermeable to laser light, so that the chip module (2) is connected to the card body (14) e.g. by means of a laser welded connection.