Chip Module Support Contact Pad Aperture Anchoring

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Solution Overview

Problem

The manufacturing of smart cards with embedded chip modules faces challenges in precise positioning and secure attachment of contact pads during machining, leading to potential rotation and misalignment, which results in poor contacts and increased costs due to wastage and potential detachment of the chip module.

Innovation Solution

Incorporating thermoplastic material with apertures in the contact pads to secure them in place through thermal bonding, preventing rotational movement and ensuring secure attachment by allowing melted polymer to pass through and harden within the apertures, forming integral plugs that anchor the pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If contact pads are embedded in the card support during manufacturing, then electrical connection between antenna and chip module is enabled, but the contact pads may rotate or shift during the milling process due to shearing forces, resulting in poor contacts and misalignment

Engineering Contradiction:

Improvecontact reliabilityVSAvoidcontact alignment precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The contact pads are pre-secured to the card support using adhesive bonding before the milling process begins. This preliminary fixation prevents rotation and shifting during subsequent machining operations, ensuring precise alignment is maintained throughout manufacturing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

An adhesive layer is introduced as an intermediary substance between the contact pads and the card support. This adhesive mediator creates a strong bonding interface that resists shearing forces during milling, preventing displacement while allowing electrical connection to be maintained.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If the chip module is made larger with a T-shape to counter-act rotation during milling, then rotational stability is improved, but the chip module becomes bulkier and increases the risk of detachment due to flexion forces

Engineering Contradiction:

Improverotational stabilityVSAvoidchip module volume

Core Design Contradiction:

Stability of the object's compositionVSVolume of moving object

Solution Approach 1:

The stability function is segmented from the chip module itself and transferred to the contact pad assembly and adhesive bonding system. Instead of making the entire chip module larger, only the contact pads are secured with adhesive, providing rotational stability without increasing chip module volume.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The rotational stability function is copied from the chip module structure to the contact pad fixation system. The adhesive-bonded contact pads replicate the stability function that would otherwise require a larger T-shaped chip module, achieving the same effect with minimal volume increase.

Inventive Principle:

Principle #26Copying

3Stability of the object's composition

If adhesive is used to secure contact pads to the card support, then positioning stability is improved, but the adhesive may melt during the milling process due to heat generation

Engineering Contradiction:

Improvecontact pad positioning stabilityVSAvoidadhesive temperature during milling

Core Design Contradiction:

Stability of the object's compositionVSTemperature

Solution Approach 1:

The adhesive selection parameters are changed to prioritize high thermal resistance and high bonding strength. By selecting adhesive materials with elevated melting points and superior thermal stability, the adhesive can withstand the heat generated during milling while maintaining bonding integrity.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

A composite bonding system is used, combining adhesive material with properties of both high adhesion strength and high thermal resistance. This composite approach allows the contact pads to remain securely bonded during high-temperature milling operations without the adhesive melting or deforming.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively secures contact pads in position, reducing misalignment and wastage, while providing a cost-effective and aesthetically appealing solution that enhances bonding strength and prevents heat-induced melting during the milling process.

Implementation Method 1

allowing melted polymer to pass through and harden within the apertures

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

secure them in place through thermal bonding

Methodology Applied

Scientific EffectThermal bonding: Heating

Data Source

PatentEP2711874B1A chip module support and a method of incorporating such a chip module support in a data carrier card

Publication Date: 2015.04.15 OBERTHUR TECH SA

Figure 1~2
Figure 3~4

AI summary

A support for a chip module 60 that can be incorporated in a data carrier 10 is provided by a support body 11 including at least one contact pad 70a,70b, embedded in the support body together with electronic elements such as an antenna 30 and the contact pad has at least one aperture 71a,71b into which a material can flow and harden to form a plug 73a,73b that substantially prevents movement of the at least one contact pad 70a,70b relative to the support body 11 when a cavity 50 is made in the support body 11 to receive a chip module 60.