Chip Module Antenna Integration for Wireless SIM Access
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Solution Overview
Problem
Existing chip modules require direct electrical contact to process or obtain data from memory and microprocessor chips, which can interfere with antenna radiation and limit wireless communication capabilities.
Innovation Solution
The chip module incorporates an antenna element connected to the RF-terminal of the chip via wire bond, coplanar transmission line, or slot line, allowing wireless communication without direct electrical contact, and includes contact pads for direct connection while positioning the antenna in areas where it won't interfere with radiation, using a dielectric substrate with multiple layers for conductive elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If direct electrical contact is used to process or obtain data from the chip, then data access is enabled, but antenna radiation is interfered with and wireless communication capability is limited
Solution Approach 1:
The chip module is divided into distinct functional zones: a contact pad area for direct electrical connection and an antenna area for wireless communication. The antenna element is positioned in a specific region of the substrate that is spatially separated from the contact pads, allowing both functions to operate independently without mutual interference.
Solution Approach 2:
The antenna element is implemented as a planar structure on the substrate surface, utilizing the two-dimensional plane of the chip module. This planar configuration allows the antenna to occupy a different spatial dimension from the contact pads, enabling coexistence of both electrical contact and wireless radiation functions within the same module footprint.
2Adaptability or versatility
If antenna element is added to enable wireless communication, then wireless capability is improved, but device complexity increases
Solution Approach 1:
The antenna element is integrated directly into the chip module substrate, merging the wireless communication function with the existing chip package structure. This integration eliminates the need for separate external antennas or additional wireless communication modules, thereby adding functionality while minimizing the increase in overall device complexity.
Solution Approach 2:
The chip module substrate serves multiple functions: it provides mechanical support for the chip, establishes electrical connections through contact pads, and acts as the radiating element for wireless communication. This multi-functionality reduces the need for separate components and simplifies the overall device architecture.
3Ease of operation
If contact pads are placed in the chip module area, then direct electrical connection is enabled, but antenna radiation is absorbed or altered
Solution Approach 1:
Different regions of the chip module substrate are assigned different functional properties: areas with contact pads are optimized for electrical connection, while the antenna region is designed specifically for radiation. The antenna element is positioned in a location where it can radiate effectively without being disrupted by the presence of conductive contact pads in other areas of the module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables wireless communication with the chip module without electrical contact, reducing interference and enhancing communication range up to 3 to 5 meters, suitable for frequencies above 800 MHz, and allows for remote data access and transactions without network connection.
Implementation Method 1
The at least one antenna element is suitable for frequencies above 800 MHz and in particular in the range of 2.4 GHz and enables a wireless communication
Implementation Method 2
This connection may be done e.g. by a wire bond, a coplanar transmission line, a slot line or a strip line
Data Source
AI summary
The invention refers to a chip module comprising at least one memory and/or microprocessor chip and at least one antenna element connected to said chip. Further the invention relates to a SIM card comprising a dielectric substrate, eight or more contact pads provided on one side of said dielectric substrate, at least one memory and/or microprocessor chip provided on the other side of the substrate and connected to said contact pads, a first antenna element provided on the same side of the dielectric substrate as the chip, wherein the first antenna element has at least one driving point and at least one termination point, a second antenna element provided on the same side of the dielectric substrate as the first antenna element, wherein the first antenna element is given in an area different from the area where the contact pads are arranged, and the chip can be accessed by a wireless communication link with help of the antenna operating at a frequency of more than 800 MHz.