Simultaneous Chip Mounting and Connector Forming

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Solution Overview

Problem

The existing manufacturing processes for power modules, such as those used in automotive applications, face inefficiencies in processing electronic chips and connector bodies, requiring separate procedures for interconnection and shaping that are time-consuming and complex.

Innovation Solution

A method and apparatus that combine the processes of interconnecting an electronic chip with a connector body using a common pressing force, allowing for simultaneous mounting and shaping of the connector body, thereby forming a strong bond and defining its shape, which simplifies the manufacturing process and reduces complexity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate procedures are used for interconnecting electronic chip with connector body and for shaping the connector body, then the interconnection reliability is ensured, but the manufacturing time and process complexity increase

Engineering Contradiction:
Improveinterconnection reliabilityVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent combines two separate manufacturing procedures (chip interconnection and connector body shaping) into a single integrated process. The pressing unit simultaneously applies pressing force to mount the electronic chip on the connector body while another pressing unit forms the connector body into its final three-dimensional shape, eliminating sequential processing steps and reducing manufacturing time while maintaining both interconnection reliability and forming quality

Inventive Principle:
Principle #5Merging (Combining)

2Device complexity

If separate procedures are used for interconnecting electronic chip with connector body and for shaping the connector body, then the process control is simplified, but the device complexity and manufacturing effort increase

Engineering Contradiction:
Improveprocess control complexityVSAvoidmanufacturing effort
Core Design Contradiction:
Device complexityVSEase of manufacture

Solution Approach 1:

The pressing units are designed to perform multiple functions: they simultaneously mount the electronic chip onto the connector body and form the connector body into its final shape. This multi-functional approach consolidates equipment requirements and reduces the number of separate processing stations needed, thereby reducing device complexity while maintaining manufacturing capability

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If common pressing force is applied for both interconnection and forming, then the manufacturing efficiency increases, but the pressing force control becomes more challenging

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidpressing force control precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The pressing force application is segmented into distinct zones: one pressing unit is dedicated to mounting the electronic chip while another pressing unit is dedicated to forming the connector body. Although both operate simultaneously, the segmentation of force application points and control zones allows independent optimization of pressing parameters for each function, maintaining manufacturing precision while achieving high productivity through parallel processing

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This combined process saves time, reduces manufacturing effort, and increases design freedom by allowing for the formation of a three-dimensionally curved connector body while ensuring a strong interconnection between the electronic chip and the connector body, resulting in a quick, reliable, and resource-saving method.

Implementation Method 1

applying a common pressing force being operative to interconnect an electronic chip with a connector body by an interconnect structure, and to contribute to a forming (or shaping) of the connector body

Methodology Applied
Scientific EffectMechanical pressure: Mechanical Force

Data Source

PatentUS10319620B2Common procedure of interconnecting electronic chip with connector body and forming the connector body
Publication Date: 2019.06.11 INFINEON TECHNOLOGIES AG
  • US10319620B2 patent drawing
  • US10319620B2 patent drawing
  • US10319620B2 patent drawing

AI summary

A method which comprises applying a common pressing force operative to interconnect an electronic chip with a connector body by an interconnect structure, and to contribute to a forming of the connector body.