Semiconductor Chip Mounting Apparatus with Pinpoint Cooling
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Solution Overview
Problem
In semiconductor chip stacking and mounting, the heat transfer during final press-attachment can cause non-conductive films (NCF) to prematurely harden in adjacent stacked bodies, leading to defective mounting due to inefficient cooling methods, which either degrade cooling efficiency or result in temperature fluctuations affecting the final press-attached chip.
Innovation Solution
A mounting apparatus with a final press-attachment head that includes both a press-attaching tool for heating and pressing the target temporarily stacked body and heat-dissipation tools to pinpoint and cool adjacent stacked bodies, preventing NCF hardening and maintaining the temperature of the chip being finally press-attached.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is applied to one temporarily stacked body for final press-attachment, then the target stacked body is properly heated for bonding, but heat is transmitted to adjacent temporarily stacked bodies causing NCF to harden prematurely
Solution Approach 1:
The patent applies local quality by introducing heat-dissipation tools with heat-dissipating bodies positioned specifically at adjacent temporarily stacked bodies. These tools create localized thermal management zones that dissipate heat only where needed (at adjacent stacked bodies) while leaving the target stacked body unaffected. This resolves the contradiction by enabling localized heat dissipation precisely where harmful heat transmission occurs, without interfering with the heating process at the target location.
2Object-affected harmful factors
If cooling air is applied to adjacent semiconductor chips to prevent temperature increase, then NCF hardening is prevented, but cooling efficiency is degraded and cooling range cannot be limited
Solution Approach 1:
The patent replaces the mechanical/conventional cooling method (cooling air) with a thermal conduction-based heat-dissipation system. Heat-dissipation tools with heat-dissipating bodies are placed in direct contact with adjacent temporarily stacked bodies, utilizing thermal conduction to efficiently remove heat. This substitution achieves superior cooling efficiency compared to air cooling, as direct thermal contact provides much higher heat transfer coefficients, while also enabling precise localization of the cooling effect.
Solution Approach 2:
The heat-dissipation tools act as intermediary elements between the adjacent temporarily stacked bodies and the heat sink. These tools with high thermal conductivity materials serve as mediators that efficiently conduct heat away from the adjacent stacked bodies without requiring direct exposure to cooling media. This intermediary approach enables controlled and efficient heat removal, resolving the limitations of direct air cooling.
3Object-affected harmful factors
If cooling air is applied to prevent temperature increase, then adjacent stacked bodies are cooled, but temperature of the stacked body being finally press-attached decreases causing defective mounting
Solution Approach 1:
The patent applies local quality by positioning heat-dissipation tools with heat-dissipating bodies specifically at adjacent temporarily stacked bodies, creating localized cooling zones. This ensures that heat is dissipated only from adjacent stacked bodies while the target stacked body remains thermally unaffected. The localized approach prevents the target stacked body from experiencing unwanted temperature decreases, thereby maintaining proper bonding conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents NCF hardening in non-target stacked bodies and ensures proper temperature maintenance for the final press-attached chip, reducing the risk of defective mounting by pinpoint cooling and heat dissipation.
Implementation Method 1
a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body
Implementation Method 2
one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with upper surfaces of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body
Data Source
AI summary
A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.