Chip Mounting Position Correction Using Average Offset Feedback
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Solution Overview
Problem
Existing chip mounting devices struggle to maintain precise positioning due to continuous shifts in the deviation center value during operation, leading to poor engineering quality and substandard Cpk values when the 3σ capability approaches the specified deviation.
Innovation Solution
A method for adjusting chip mounting positions by obtaining offsets of actual mounting positions, calculating an average offset, and adjusting the mounting position accordingly, thereby improving precision and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If chip mounting is performed using conventional positioning methods, then the initial mounting position can be achieved, but the deviation center value shifts during continuous operation leading to poor engineering quality
Solution Approach 1:
The patent implements a feedback mechanism where the actual mounting positions of chips are measured and compared against target positions. The deviation center value is calculated from these measurements and used to dynamically adjust the positioning system. This closed-loop feedback ensures that even as the deviation center shifts during continuous operation, the system compensates in real-time to maintain consistent mounting accuracy and engineering quality.
Solution Approach 2:
The patent changes the positioning parameters dynamically by calculating the deviation center value from actual mounting data and using this to adjust mounting position parameters. Instead of using fixed positioning parameters, the system continuously updates them based on measured deviations, transforming the positioning approach from static to adaptive to maintain precision throughout continuous operation.
2Manufacturing precision
If the 3σ capability approaches the specified deviation, then the device capability limit is reached, but the position deviation center value continues to shift during continuous operation
Solution Approach 1:
The system continuously monitors actual mounting positions and calculates the deviation center value, feeding this information back to the positioning system. This feedback loop detects shifts in the deviation center during continuous operation and triggers automatic compensation, ensuring that mounting precision is maintained even when the deviation center becomes unstable.
Solution Approach 2:
The patent transitions from static positioning parameters to dynamic adjustment by continuously updating the deviation center value based on actual mounting data. The positioning system becomes adaptive, automatically adjusting to maintain precision as operating conditions change during continuous operation, rather than relying on fixed parameters that cannot compensate for drift.
3Productivity
If chip mounting position is not adjusted, then the process is simple, but the position deviation accumulates leading to substandard Cpk values
Solution Approach 1:
The patent implements automatic feedback-based adjustment where the deviation center value is calculated from actual mounting positions and used to correct subsequent mounting operations. This automated feedback mechanism maintains high position accuracy without requiring manual intervention, thus preserving productivity while eliminating position deviation accumulation that would otherwise degrade Cpk values.
Solution Approach 2:
The positioning system performs self-adjustment by automatically calculating the deviation center from measured data and applying corrections without external intervention. This self-service capability maintains manufacturing precision throughout continuous operation, preventing Cpk degradation while keeping the process efficient and automated.
Data Source
AI summary
A method for adjusting a chip mounting position, an apparatus, a medium, and an electronic device are provided. The adjustment method includes: obtaining offsets of actual mounting positions of individual chips in a first group of chips; obtaining an average offset for the actual mounting positions of the individual chips in the first group of chips according to the offsets of the actual mounting positions of the individual chips in the first group of chips; and adjusting the chip mounting position according to the average offset for the actual mounting positions of the individual chips in the first group of chips.