Semiconductor Chip Mounting Inspection Using Peripheral References
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Solution Overview
Problem
Existing techniques for inspecting the mounting position of semiconductor chips face challenges in accurately recognizing chip corners due to non-vertical edges, leading to inaccuracies in positioning verification.
Innovation Solution
An inspection device and method that measures reference positions of mounting and peripheral sections before and after chip mounting, calculating relative positions based on distances between these points to ensure accurate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If image processing is used to recognize chip corners based on alignment marks, then the inspection process can be automated, but the measurement precision deteriorates when chip edges are not vertical
Solution Approach 1:
The patent introduces peripheral sections as intermediary reference objects between the mounting section and the semiconductor chip. These peripheral sections serve as stable reference points that are not affected by the chip's edge orientation, enabling accurate position measurement even when chip edges are non-vertical. The measurement system uses these intermediary references to calculate the chip's mounting position indirectly, resolving the contradiction between automation and precision.
2Ease of manufacture
If chip corner recognition is used for position inspection, then the inspection method is simple, but the manufacturing precision deteriorates due to inaccurate corner detection
Solution Approach 1:
The patent divides the measurement system into separate functional components: mounting section, peripheral sections, and semiconductor chip. By segmenting the reference system into multiple peripheral sections with known positions, the method enables accurate position calculation through coordinate geometry without requiring direct corner detection. This segmentation maintains simplicity while improving manufacturing precision.
3Productivity
If direct corner detection is used, then the inspection process is fast, but the reliability deteriorates when edges are not vertical
Solution Approach 1:
The patent performs preliminary measurement of peripheral section positions before chip mounting. These pre-measured peripheral sections serve as reliable reference points that remain valid throughout the inspection process. By establishing these references in advance, the system achieves both fast inspection (no need to re-measure references) and high reliability (references are not affected by chip edge orientation).
Data Source
AI summary
An inspection device includes: a measurement part, measuring a reference position of a mounting section before mounting of a semiconductor chip, a reference position of a plurality of peripheral sections located around the mounting section, and a position of the semiconductor chip after mounting; and an inspection part, inspecting a relative position of the semiconductor chip with respect to the mounting section based on a distance between the reference position of the mounting section and the reference position of the plurality of peripheral sections measured by the measurement part and a distance between the reference position of the plurality of peripheral sections and a mounting position of the semiconductor chip after mounting of the semiconductor chip.