Chip Mounting Stage Layout for Compact Pressure Bonding
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Solution Overview
Problem
The existing semiconductor mounting devices require two stages for chip component bonding, leading to a larger device size due to simultaneous pressurization and heating of multiple components, which complicates the mounting process and increases the device's footprint.
Innovation Solution
A single-stage mounting device with a temporary placement stage and a mounting head that uses suction to position and secure chip components on a substrate, allowing for simultaneous pressurization and heating, reducing the device's size by eliminating the need for a separate final pressure-bonding stage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two stages (temporary pressure-bonding stage and final pressure-bonding stage) are provided to perform sequential chip component mounting, then the chip components can be mounted with proper bonding process control, but the device becomes large in size
Solution Approach 1:
The patent merges the temporary pressure-bonding stage and final pressure-bonding stage into a single integrated mounting stage. This stage can perform both temporary bonding (at lower temperature) and final bonding (at higher temperature with pressure) operations, eliminating the need for separate stages and reducing overall device size while maintaining reliable bonding process control
Solution Approach 2:
The mounting stage is designed with dynamic temperature control capability, allowing it to switch between different temperature zones or heating modes. This enables the same stage to perform temporary bonding at lower temperatures and final bonding at higher temperatures, providing process flexibility without requiring separate static stages
2Productivity
If multiple chip components are pressurized and heated simultaneously in the final pressure-bonding stage, then the mounting time is reduced, but the device complexity increases due to requiring two stages
Solution Approach 1:
The patent combines multiple chip component handling operations into a single mounting stage that can simultaneously perform temporary bonding and final bonding. This reduces device structural complexity while maintaining the ability to process multiple chip components in parallel, thus preserving high productivity
3Volume of stationary object
If a single stage is used to hold the substrate, then the device size is reduced, but the capability to perform both temporary and final pressure bonding may be compromised
Solution Approach 1:
The single mounting stage is designed with multi-functionality, incorporating both temporary pressure-bonding capability (with controlled lower temperature heating) and final pressure-bonding capability (with higher temperature and pressure application). This universal stage can adapt to different bonding requirements without compromising process capability while maintaining reduced device size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact device configuration with high productivity by allowing multiple chip components to be bonded in a single stage, reducing the device's size and maintaining efficient bonding processes while preventing premature curing of the adhesive.
Implementation Method 1
a temporary placement stage on which a plurality of the chip components are loaded
Implementation Method 2
a mounting head suctioning the plurality of chip components loaded on the temporary placement stage
Implementation Method 3
pressurizing while keeping the relative positions at the predetermined positions on the substrate
Data Source
AI summary
A semiconductor mounting device for mounting chip components on a substrate, wherein the device is reduced in size. A semiconductor mounting device 10 comprises: a temporary placement stage 12 on which are loaded a plurality of chip components 30a, 30b, 30c; a conveyance head 14 that conveys the chip components 30a, 30b, 30c to the temporary placement stage 12, and also loads each of the chip components 30a, 30b, 30c on the temporary placement stage 12 so that the relative positions of the plurality of chip components 30a, 30b, 30c reach predetermined positions; a mounting stage 16 that secures a substrate 36 by suction; and a mounting head 18 that suctions the plurality of chip components 30a, 30b, 30c loaded on the temporary placement stage 12, and pressurizes while keeping the relative positions at prescribed positions on the substrate 36 that is secured by suction to the mounting stage 16.