Chip Component Mounting Structure Stress Distribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniaturization and increased density of chip components lead to issues such as cracking, low flexural strength, and breakage due to concentrated stress at the boundaries between external terminal electrodes and the element body, particularly at the intersection points where stress is applied.
Innovation Solution
The mounting structure optimizes the bonding position relationship between external terminal electrodes and lands on the substrate by ensuring a sufficient distance (d > t/tan 35°, preferably d > t/tan 25°) between the edges of the external terminal electrodes and the land edges, allowing for improved resistance to cracking and enhanced connective reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chip components are miniaturized and density is increased, then productivity and space utilization are improved, but flexural strength decreases and cracking occurs at terminal boundaries
Solution Approach 1:
The patent changes the geometric parameters of the mounting structure by optimizing the distance d between the terminal electrode edge and land edge, and by controlling the thickness t of the chip component. These parameter adjustments ensure that stress is distributed away from critical boundaries, maintaining flexural strength even as component size decreases and mounting density increases.
2Volume of moving object
If chip components are miniaturized, then space utilization is improved, but stress concentration at intersection points increases leading to breakage
Solution Approach 1:
The patent applies local quality by creating a specific geometric configuration at the critical boundary region between the terminal electrode and land. By controlling the distance d from the terminal edge to the land edge, the design creates a stress-distributing geometry in the critical zone, while the rest of the miniaturized component maintains its compact size for high density mounting.
3Reliability
If bonding position is optimized to prevent cracking, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent achieves improved reliability through parameter optimization rather than structural complexity. By defining specific relationships between distance d, land edge position, and chip thickness t, the design maintains simple geometric forms while ensuring stress is properly distributed. This approach avoids complex multi-component structures while achieving enhanced connective reliability.
Data Source
AI summary
A mounting structure of a chip component includes a chip component that is bonded by having a pair of external terminal electrodes provided on both ends of an element body of the thin chip component bonded to a pair of lands respectively through solder, the pair of lands being provided on an attaching substrate in a lateral direction with respect to each other. Where plan view distances from ends of the external terminal electrodes at the ridge lines formed between the surfaces and side faces of the element body of the chip component to the edges of the lands connected to the external terminal electrodes are designated as “d,” and the vertical distances from the bottom surfaces of the external terminal electrodes and the lands are designated as “t,” then d>t/tan 35° and preferably d>t/tan 25° is fulfilled.