Chip Moving Device Horizontal Clamping Adsorption
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Solution Overview
Problem
In chip testing and patching processes, the existing patch adsorption structures using magnet adsorption can cause increased pick-and-place pressure, risking damage to the chip surface due to the angle of the magnet's adsorption force.
Innovation Solution
A chip moving device is designed with a base, an adsorption part, and a clamping component. The clamping component is telescopic in the horizontal direction, providing a clamping force to the adsorption part without generating a vertical component force, thus preventing chip damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If magnet adsorption is used for the adsorption part, then the adsorption part can be held and moved, but the adsorption force forms an angle with the horizontal direction during large Z-axis movement, causing increased pick-and-place pressure that risks crushing the chip surface
Solution Approach 1:
The patent extracts the harmful vertical component of the adsorption force by separating the adsorption function from the clamping function. The magnet is removed from the adsorption part and placed in the base, so that adsorption force acts horizontally without creating vertical pressure on the chip surface.
Solution Approach 2:
The patent changes the dimensional arrangement of the adsorption force by rotating the magnetic field orientation from vertical to horizontal. This allows the adsorption part to be held securely during Z-axis movement without the adsorption force creating harmful vertical components that could damage the chip.
2Length of moving object
If the adsorption part moves along the Z-axis with large stroke, then the chip testing and patching processes can be completed, but the direction of the magnet's adsorption force forms an angle with the horizontal direction, leading to increased pick-and-place pressure
Solution Approach 1:
The patent extracts the source of harmful vertical pressure by removing the magnet from the adsorption part. This allows the adsorption part to move freely along the Z-axis with large stroke while the horizontal magnet in the base provides adsorption force without creating vertical components.
3Reliability
If a clamping component is added to provide horizontal clamping force, then the adsorption part can be securely clamped without vertical force components, but the device structure becomes more complex
Solution Approach 1:
The patent merges the magnet with the base structure, combining the adsorption function into the existing base rather than adding a separate adsorption mechanism. This reduces overall device complexity while providing secure horizontal clamping through the elastic part and limiting component.
Solution Approach 2:
The elastic part automatically provides clamping force against the adsorption part, and the limiting component self-regulates the position of the adsorption part. This self-service mechanism ensures reliable clamping without requiring complex external control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device ensures stable pick-and-place pressure without damaging the chip, and allows for easy replacement of the adsorption part, enhancing the assembly stability and preventing chip surface damage.
Implementation Method 1
an elastic part, arranged in the assembly cavity and connected between the mounting portion and the sliding portion
Implementation Method 2
The patch adsorption structure of the chip testing machine applies magnet adsorption
Data Source
AI summary
Chip moving device is provided. The chip moving device includes a base, including a mounting portion that includes an end surface and an assembly cavity extending in a horizontal direction and penetrating through the end surface, the end surface being arranged with a limiting component; an adsorption part, extending in a vertical direction and confined by the limiting component; and a clamping component, arranged in the assembly cavity and including an end extending out of the end surface of the mounting portion, the clamping component being configured to be telescopic in the horizontal direction, and provide the adsorption part with a clamping force in the horizontal direction when the clamping component is extended or contracted.