IC Chip Nozzle Alignment for Precise Antenna Mounting

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Solution Overview

Problem

Existing IC chip mounting apparatuses lack precision in placing IC chips on antennas due to limited movement capabilities, which affects the accuracy of the mounting process.

Innovation Solution

An IC chip mounting apparatus with a nozzle system that includes a rotating unit, a moving machine, and an image acquisition unit to correct the position and orientation of the IC chip, allowing for precise placement by determining and applying correction amounts for angle, conveying direction, and width direction adjustments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a synchronization roller is used to suck and hold an IC chip, then the IC chip can be transported to the mounting position, but the mounting precision is limited due to restricted movement directions (only X and Y axes)

Engineering Contradiction:
ImproveIC chip mounting precisionVSAvoidnozzle movement system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent introduces a rotational degree of freedom (theta axis) in addition to the existing X and Y linear movements. The nozzle can now rotate around the suction hole axis, enabling three-dimensional positioning (X, Y, and rotation angle). This dimensional expansion allows precise angular alignment of the IC chip with the antenna, resolving the mounting precision limitation without requiring complex multi-axis linear mechanisms.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The nozzle is designed with dynamic rotational capability around its suction hole axis through a rotation unit. This dynamic adjustment allows the nozzle to orient the IC chip at the precise angle required for mounting, transforming the static positioning system into a dynamic one that can adapt to angular requirements, thereby improving mounting precision.

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If the nozzle position is fixed after IC chip suction, then the device structure is simple, but correction of IC chip position and orientation is not possible

Engineering Contradiction:
ImproveIC chip position and orientation accuracyVSAvoidnozzle adjustment mechanism complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The nozzle assembly incorporates rotational mechanisms that allow dynamic adjustment of the nozzle orientation around the suction hole axis. This enables real-time correction of IC chip orientation and position during the mounting process, transforming a static nozzle into a dynamically adjustable positioning tool that can compensate for alignment errors.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system uses image acquisition to detect the IC chip position and orientation, then feeds this information back to the rotation unit to adjust the nozzle angle. This closed-loop feedback mechanism enables automatic correction of mounting position and orientation, achieving high precision without manual intervention while keeping the overall system architecture relatively simple.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves the accuracy of IC chip placement on antennas, enhancing the precision and reliability of the mounting process in inlay manufacturing.

Implementation Method 1

a nozzle (32) configured to suck an IC chip when located at a first position

Methodology Applied
Scientific EffectSuction: Suction

Data Source

PatentEP4084047B1IC chip-mounting device and IC chip-mounting method
Publication Date: 2024.08.21 SATO HLDG CORP
  • EP4084047B1 patent drawingFigure 1
  • EP4084047B1 patent drawingFigure 2
  • EP4084047B1 patent drawingFigure 3

AI summary

The present invention is an IC chip mounting apparatus for mounting an IC chip at a reference position of an inlay antenna while conveying the antenna, the IC chip mounting apparatus including: a nozzle configured to suck an IC chip when located at a first position and to place the IC chip at the reference position of the antenna when located at a second position; a nozzle attachment to which the nozzle is attached; an image acquisition unit configured to acquire an image of the IC chip sucked by the nozzle; and a correction amount determination unit configured to determine correction amounts for the IC chip sucked by the nozzle, based on the image acquired by the image acquisition unit. The correction amounts includes a first correction amount for correcting an angle of the nozzle around the axis, a second correction amount for correcting a position of the antenna in a conveying direction of the antenna, and a third correction amount for correcting the position of the antenna in a width direction.