Chip-on-Chip Mounting Apparatus for Semiconductor Stacking
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Solution Overview
Problem
Conventional component mounting apparatuses are not suitable for bonding pairs of semiconductor chips of similar size, which is required for high-density chip-on-chip (COC) structures in electronic devices, as they are designed for larger boards and lack the capability to efficiently handle and bond smaller chips.
Innovation Solution
A component mounting apparatus and method that includes a component feeding unit, a mounting stage, and a mounting unit with a transporting unit to pick up, transfer, and mount a second component onto a first component, allowing for effective stacking and bonding of semiconductor chips with similar sizes, using a mounting head and suction mechanism for precise positioning and solder bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional component mounting apparatus is used for mounting semiconductor chips on large boards, then the apparatus can handle large boards easily, but the apparatus is not suitable for bonding pairs of semiconductor chips of similar size for high-density COC structures
Solution Approach 1:
The component transporting unit is designed to perform multiple functions: transporting the first component to the mounting stage, transferring the second component from the feeding unit to the mounting head, and carrying out the mounted assembly. This multi-functional design enables the apparatus to handle both large board mounting and chip-on-chip configurations without requiring separate specialized equipment, thereby improving adaptability while controlling complexity
2Ease of operation
If conventional mounting apparatus is designed for large boards, then the board can be easily handled, but the apparatus lacks capability to efficiently handle and bond smaller chips of similar size
Solution Approach 1:
The mounting stage is designed to be movable and adaptable, allowing it to accommodate different component sizes and configurations. The component transporting unit dynamically adjusts its operation to handle either large boards or small chip pairs, optimizing ease of operation and productivity for different mounting scenarios including chip-on-chip structures
3Productivity
If component transporting unit transports first component to mounting stage and carries out mounted component, then the apparatus can effectively perform COC mounting operations
Solution Approach 1:
The component transporting unit merges multiple operations into a single integrated mechanism: transporting the first component to the mounting stage, transferring the second component to the mounting head, and carrying out the final mounted assembly. This consolidation improves productivity by eliminating the need for separate handling mechanisms while managing complexity through integrated design
Data Source
AI summary
In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.