Chip on Leadframe Optical Subassembly Design
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Solution Overview
Problem
Existing optical subassemblies, particularly those using transistor outline (TO) cans, increase manufacturing costs and may create electrical discontinuities due to the complexity and number of components required for signal conversion between electrical and optical domains.
Innovation Solution
A chip on leadframe optical subassembly (COL OSA) design that mechanically and electrically couples an active optical component subassembly to a leadframe circuit, reducing component count and enabling longer metal leads for high-speed signal transmission without intermediate connection media.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a TO can package is used for optical subassembly, then the optical components are hermetically sealed and protected, but the number of components increases and manufacturing costs increase
Solution Approach 1:
The patent merges the optical component mounting function and hermetic sealing function into a single integrated TO can structure. The TO can simultaneously serves as the housing that seals the optical components (photodiode or laser diode) and as the mounting substrate, eliminating the need for separate mounting plates or carriers. This integration reduces the total component count while maintaining protective sealing.
2Reliability
If a TO can package is used for optical subassembly, then the optical components are protected, but electrical discontinuities may occur and manufacturing costs increase
Solution Approach 1:
The TO can integrates multiple functions including protective housing, mounting substrate, and electrical connection element. By combining these functions into a single component, the patent reduces the total number of parts that need to be manufactured, stored, and assembled, thereby lowering manufacturing costs while maintaining component protection.
Solution Approach 2:
The TO can serves multiple functions simultaneously: it acts as a protective housing for the optical components, a mounting substrate for securing the components, and an electrical connection element that interfaces with the PCB. This multi-functionality reduces the need for additional specialized components, simplifying the overall assembly and reducing costs.
3Reliability
If traditional TO can configuration is used, then optical components are sealed, but assembly complexity increases
Solution Approach 1:
The patent combines the sealing housing and mounting substrate into a single TO can structure. This integration means that the optical components are secured directly to the TO can itself, eliminating the need for separate mounting plates or carriers that would require additional assembly steps. The unified structure simplifies the assembly process while maintaining hermetic sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The COL OSA design reduces manufacturing costs and assembly complexity while maintaining high-speed signal transmission capabilities, offering a more efficient and cost-effective solution for optoelectronic devices compared to traditional TO can configurations.
Implementation Method 1
A laser diode or similar optical transmitter included in the TOSA is driven to emit the optical signal representing the electrical signal received from the host device
Implementation Method 2
A photodiode or similar optical receiver included in the ROSA transforms the optical signal to the electrical signal
Data Source
AI summary
One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.