Chip Package Alignment Marks and Light Shielding Layer
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Solution Overview
Problem
Existing chip packaging technologies face challenges in achieving precise alignment and light shielding for optical-electronic devices, leading to noise interference and reduced precision in light sensing or emitting applications.
Innovation Solution
A chip package design featuring a substrate with an optical device, conducting pad, and a light shielding layer, where alignment marks on both surfaces facilitate precise alignment and light shielding, ensuring optimal operation by blocking external light and preventing noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a light shielding layer is added to block external light, then light shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The light shielding layer is integrated with the substrate structure, merging the shielding function into the existing package body rather than adding a separate component. This reduces overall device complexity while maintaining effective light blocking capability.
Solution Approach 2:
The light shielding layer serves multiple functions: it blocks external light from reaching the optical device, provides structural support, and acts as a mounting surface for alignment marks. This multi-functionality reduces the need for additional components.
2Manufacturing precision
If alignment marks are formed on both surfaces of the substrate, then alignment precision is improved, but manufacturing complexity increases
Solution Approach 1:
Alignment marks are pre-formed on both the first and second surfaces of the substrate during the manufacturing process. This preliminary action enables precise alignment to be achieved without requiring complex real-time adjustment mechanisms during assembly.
Solution Approach 2:
The alignment marks serve as intermediary reference features that mediate the alignment between the optical device on the first surface and the light shielding layer on the second surface. These marks provide a common reference framework that simplifies the alignment process.
Data Source
AI summary
An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optical device disposed on the first surface; a conducting pad disposed on the first surface; a first alignment mark formed on the first surface; and a light shielding layer disposed on the second surface and having a second alignment mark, wherein the second alignment mark corresponds to the first alignment mark.