Chip Package Anchor Structure for Antiwarpage Bonding Accuracy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Forming a reliable chip package structure with multiple chips is challenging due to the complexity of integrating multiple functions and ensuring structural stability and reliability, particularly in reducing warpage and thermal stress.
Innovation Solution
The solution involves a chip package structure that includes a carrier substrate, adhesive layers, chips with conductive structures, a redistribution structure, anchor structures, and an antiwarpage structure. The anchor structures are used to align and secure the antiwarpage structure, improving bonding accuracy and reducing warpage, while the antiwarpage structure aids in heat dissipation and structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple chips are integrated into a single package to achieve multiple functions, then the functionality and versatility of the device is improved, but the structural complexity and difficulty of ensuring reliability increase
Solution Approach 1:
The patent divides the package structure into distinct functional modules: carrier substrate for chip mounting, redistribution layers for electrical connections, anchor structures for mechanical support, and antiwarpage structures for stability. Each segment performs a specific function, allowing complex multi-chip integration while maintaining manageability through modular design.
Solution Approach 2:
The patent implements a hierarchical nesting structure where chips are mounted on the carrier substrate, which is then integrated with redistribution layers, anchor structures, and antiwarpage structures in successive layers. This nested arrangement allows multiple functional layers to be compactly integrated while maintaining clear structural boundaries and functional independence.
2Ease of manufacture
If traditional packaging methods are used without anchor structures, then the manufacturing process is simpler, but warpage and thermal stress cause reliability issues
Solution Approach 1:
The patent incorporates anchor structures into the package design before final assembly and bonding processes. These anchor structures are pre-positioned on the carrier substrate to provide mechanical reference points and structural reinforcement that prevent warpage during subsequent manufacturing steps and operational thermal cycling, ensuring reliability without complicating the overall manufacturing flow.
3Stability of the object's composition
If antiwarpage structures are added to reduce warpage and thermal stress, then the structural stability is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent places antiwarpage structures at specific critical locations on the carrier substrate where warpage and thermal stress are most likely to occur, rather than uniformly distributing them across the entire package. This localized approach provides maximum structural stability where needed while minimizing the overall complexity and material usage of the antiwarpage system.
4Manufacturing precision
If anchor structures are used to align and secure the antiwarpage structure, then the bonding accuracy is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The anchor structures are designed to automatically provide alignment references and mechanical guidance during the bonding process between the carrier substrate and antiwarpage structures. This self-aligning mechanism eliminates the need for complex external alignment equipment or additional bonding steps, achieving high bonding accuracy while keeping the manufacturing process relatively simple.
Data Source
AI summary
A chip package structure is provided. The chip package structure includes a wiring substrate having a surface. The chip package structure includes a chip structure over the surface of the wiring substrate. The chip package structure includes an antiwarpage structure over the surface of the wiring substrate. The antiwarpage structure surrounds the chip structure. The chip package structure includes a first anchor structure affixed to the surface of the wiring substrate and adjacent to a first lower portion of the antiwarpage structure. The first lower portion is between the first anchor structure and the chip structure, and the first anchor structure is electrically isolated from the chip structure.