Chip Package Anchor Structures for Thin-Substrate Warpage Control
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Solution Overview
Problem
Conventional semiconductor chip package substrates face challenges with warpage due to differences in thermal expansion coefficients between the chip and the substrate, leading to potential chip fracture and molding layer delamination.
Innovation Solution
The use of plural anchor structures or a stiffener ring with openings that fill with molding material, providing mechanical engagement and anchoring to prevent delamination and increase substrate stiffness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a coreless or thin core build-up substrate is used, then the substrate thickness is reduced, but the substrate stiffness is insufficient leading to warpage and molding layer delamination
Solution Approach 1:
The substrate is segmented into multiple build-up layers with metal interconnect layers distributed throughout. These layered segments work together to provide structural support and stiffness while maintaining overall thinness, preventing warpage without requiring a thick core
Solution Approach 2:
The substrate uses composite construction combining organic build-up layers with metal interconnect layers (copper, aluminum, or alloy). This composite structure provides both mechanical support and electrical functionality, achieving sufficient stiffness in a thin configuration while preventing delamination through the distributed metal layers
2Length of moving object
If the substrate is made thinner, then the package size is reduced, but the risk of molding layer delamination increases due to insufficient substrate stiffness
Solution Approach 1:
The metal interconnect layers are segmented and distributed at multiple levels within the thin substrate structure. This segmentation creates numerous anchoring points throughout the substrate thickness that mechanically interlock with the molding layer, preventing delamination even in thin substrates
Solution Approach 2:
Metal interconnect layers are strategically positioned at specific locations within the substrate, particularly near the molding layer interface. This local concentration of metal provides enhanced mechanical anchoring and adhesion precisely where the molding layer attaches, ensuring reliability without increasing overall substrate thickness
Data Source
AI summary
Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.