Chip Package Integrated Antenna Structure With Printed Through-Hole Links
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Solution Overview
Problem
Current SiP technology faces challenges in integrating antennas due to complex manufacturing processes, environmental pollution, limited miniaturization, and low connection reliability, particularly with the use of metal shrapnel and conductive paste methods.
Innovation Solution
A chip package integrated antenna structure and manufacturing method that includes a substrate with chip units and conductive units, an encapsulation with through holes, conductive structures, and an antenna connected via pad printing, addressing the issues of space, reliability, and environmental concerns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal shrapnel structure is used to connect antenna to SiP module, then connection reliability is improved, but device complexity and space occupation increase
Solution Approach 1:
The patent extracts and eliminates the metal shrapnel structure from the antenna connection system. Instead of using shrapnel to bridge the antenna and SiP module, the invention directly integrates the antenna pattern into the encapsulation layer, removing the intermediate shrapnel component and its associated chemical plating processes, thereby simplifying the overall structure while maintaining connection reliability.
Solution Approach 2:
The patent merges the antenna structure with the encapsulation layer by forming the antenna pattern directly within the encapsulation material. This integration combines previously separate components (antenna and encapsulation) into a unified structure, eliminating the need for separate shrapnel connectors and reducing overall device complexity.
2Manufacturing precision
If laser direct structuring (LDS) method is used to form antenna, then manufacturing precision is improved, but environmental pollution and process complexity increase
Solution Approach 1:
The patent replaces the laser direct structuring (LDS) method with a printing-based approach. Instead of using laser energy to directly structure the antenna pattern, the invention employs printing processes to form the antenna pattern within the encapsulation layer, substituting a mechanical/printing system for the thermal/laser system, thereby reducing environmental pollution from chemical plating while maintaining manufacturing precision.
3Reliability
If through holes are opened deep in encapsulation to connect antenna, then electrical connectivity is improved, but heat accumulation and chip removal difficulty increase
Solution Approach 1:
The patent applies partial action by forming the antenna pattern partially within the encapsulation layer rather than requiring complete through-holes. The antenna pattern is embedded in the encapsulation material, establishing electrical connectivity without the need for deep through-hole penetration, thereby reducing laser processing time and heat accumulation while maintaining sufficient electrical connection.
4Ease of manufacture
If conductive paste is used to fill holes for antenna connection, then ease of manufacture is improved, but void formation and connection reliability worsen
Solution Approach 1:
The patent merges the antenna pattern formation with the encapsulation process itself. The antenna pattern is formed directly within the encapsulation material during or after encapsulation, eliminating the separate step of filling through-holes with conductive paste. This integration ensures complete material density without voids while maintaining ease of manufacture, as the antenna pattern is created as part of the encapsulation process rather than as a separate assembly step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances signal stability by eliminating oxidation issues, reduces the filling path for conductive paste, and minimizes heat accumulation during laser processing, thereby improving the reliability and miniaturization of antenna integration in SiP modules.
Implementation Method 1
performing a hole-opening process on the at least two marked areas to respectively form at least two through holes in the encapsulation
Implementation Method 2
performing a pad printing process to form an antenna on the top surface, and connecting the antenna to the at least two conductive structures
Data Source
AI summary
A structure of a chip package integrated antenna and a manufacturing method thereof are proposed, and the structure includes a substrate, at least one chip unit, at least two conductive units, an encapsulation, at least two conductive structures and an antenna. The chip unit and the two conductive units are disposed on the substrate. The encapsulation covers the chip unit and the two conductive units, and has a top surface and at least two through holes. The two through holes are respectively formed between the top surface and the two conductive units. The two conductive structures are respectively disposed on the two conductive units and located in the two through holes. The antenna is disposed on the top surface and connected to the two conductive structures, and is electrically connected to the chip unit through the two conductive structures, the two conductive units and the substrate in sequence.