Chip Package Heat Sink Structure Using Arc Thermal Lead
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Solution Overview
Problem
Current chip packaging technologies, such as Ball Grid Array (BGA), face challenges with heat dissipation due to the use of plastic packaging materials with poor thermal conductivity, leading to inefficient heat transfer and potential overflow issues during the packaging process, which affects both heat dissipation and electrical performance.
Innovation Solution
A method is introduced that involves forming an arc-shaped heat-conducting lead on the chip, connecting it to a solder ball, and using a heat-conducting adhesive layer to enhance heat dissipation by increasing the contact area with a heat dissipation layer, which includes a metal body and coating layer, thereby improving thermal conductivity and reducing manufacturing complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is added to the PBGA package structure to improve heat dissipation, then heat dissipation efficiency is improved, but the plastic packaging material layer with poor thermal conductivity blocks heat transfer and reduces the effectiveness of the heat sink
Solution Approach 1:
The patent segments the heat dissipation path by separating the plastic packaging material layer from the heat sink connection. The heat-conducting lead provides a dedicated thermal conduction channel that bypasses the insulating plastic layer, creating an independent heat transfer pathway from the chip to the heat sink.
Solution Approach 2:
The heat-conducting lead acts as an intermediary element between the chip and the heat sink. This metallic lead with high thermal conductivity serves as a thermal bridge, transferring heat efficiently while avoiding the thermal resistance of the plastic packaging material.
2Ease of manufacture
If the heat sink is mounted after chip bonding and then plastic packaging is applied, then the packaging process is simplified, but the plastic material overflows on the heat sink surface and reduces heat dissipation effectiveness
Solution Approach 1:
The patent applies preliminary action by pre-forming the heat-conducting lead structure with the chip before plastic packaging. The lead is already in place and properly positioned, so the subsequent plastic packaging process does not cause overflow on the heat sink surface, as the heat sink is not yet mounted when the plastic is applied.
Solution Approach 2:
The patent inverts the conventional sequence by not mounting the heat sink before packaging. Instead, the heat-conducting lead is formed first, then plastic packaging is applied, and finally the heat sink is mounted. This reversal avoids the overflow problem that occurs when plastic is applied over an already-mounted heat sink.
3Loss of energy
If the heat-conducting lead is formed with an arc-shaped vertical wire structure, then heat transfer area is increased and thermal conductivity is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies curvature by forming the heat-conducting lead as an arc-shaped vertical wire rather than a straight wire. This curved structure increases the surface area and contact area for heat transfer, improving thermal conductivity while the wire bonding process naturally accommodates the curved shape.
Solution Approach 2:
The heat-conducting lead serves multiple functions: it provides electrical connection, mechanical support, and enhanced thermal conduction. The arc-shaped structure achieves improved heat transfer without requiring separate thermal management components, consolidating multiple functions into a single element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively enhances heat dissipation efficiency by increasing the heat transfer area and reducing manufacturing costs through the use of existing equipment, while maintaining the structural integrity and performance of the chip package.
Implementation Method 1
the heat-conducting lead transfers the heat from the chip to the heat dissipation layer
Implementation Method 2
the first end is connected with a surface of the chip through a wire bonding bump
Implementation Method 3
the second end is connected with a solder ball
Data Source
AI summary
The present disclosure provides a chip package structure having a heat sink and a method making the same. The method includes: bonding a chip to a top surface of a package substrate and forming a heat-conducting lead having an arc-shape and placed on the chip in a vertical direction, a first end of the heat-conducting lead is connected with a surface of the chip, and a second end is connected with a solder ball; forming a plastic package material layer that protects the chip and the heat-conducting lead; forming a heat-conducting adhesive layer on the surface of the plastic package material layer, where the heat-conducting adhesive layer is connected with the solder ball on the second end of the heat-conducting lead; and forming a heat dissipation layer on a surface of the heat-conducting adhesive layer. With the present disclosure, the heat dissipation efficiency of the chip is effectively improved.