Chip Package Anti-Warpage Bump Design
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Solution Overview
Problem
The semiconductor industry faces manufacturing challenges in improving the integration density and functionality of semiconductor devices due to limitations in packaging technologies, particularly in reducing warpage and stress in 3D packaging structures.
Innovation Solution
The implementation of anti-warpage bumps and solder balls with specific thermal expansion coefficients and shapes, along with a redistribution structure and underfill layers, to reduce warpage and enhance the structural integrity of chip packages during the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If 3D packaging structures are used to improve integration density, then the functionality and compactness are enhanced, but warpage and stress issues worsen
Solution Approach 1:
The patent applies parameter changes by carefully selecting and controlling the thermal expansion coefficients of different materials in the packaging structure. The underfill material, molding compound, and substrate are chosen with specific thermal expansion properties to match and balance each other, reducing thermal stress and warpage during temperature cycling while maintaining 3D packaging integrity
Solution Approach 2:
The patent uses composite materials by combining multiple materials with different properties in the packaging structure. The underfill layer combines epoxy resin with filler particles to achieve desired mechanical and thermal properties, while the molding compound integrates various polymers and fillers to create a composite structure that compensates for warpage and stress in 3D packaged devices
2Area of stationary object
If packaging size is reduced to improve density, then area and height are decreased, but manufacturing challenges increase
Solution Approach 1:
The patent applies local quality by implementing a redistribution structure with varying trace widths and via configurations in different regions of the package. The underfill and molding compound are applied with specific local properties to compensate for stress concentrations in critical areas, enabling miniaturization while maintaining manufacturability through localized structural optimization
Solution Approach 2:
The patent transitions from 2D to 3D packaging architecture, stacking multiple semiconductor devices vertically to reduce the footprint area. This dimensional change allows higher density while the underfill and molding compound provide structural support and stress management in the vertical dimension, addressing manufacturing challenges through three-dimensional structural design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces warpage and stress in chip packages, improving the yield and reliability of 3D packaging by using anti-warpage bumps and solder balls with tailored thermal expansion properties, and a redistribution structure with underfill layers to stabilize the chip package structure.
Implementation Method 1
anti-warpage bumps and solder balls with specific thermal expansion coefficients and shapes, along with a redistribution structure and underfill layers, to reduce warpage and enhance the structural integrity
Data Source
AI summary
A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.