Chip Package Capping Layer Protects Sensing Device During Dicing

Solution Overview

Problem

Conventional chip packaging processes often contaminate or damage sensing devices, leading to reduced performance and reliability of chip packages.

Innovation Solution

A method involving a substrate with a sensing device and a capping layer attached by an adhesive layer, where the capping layer and adhesive cover the sensing device during the dicing process to protect it, and through silicon vias or ring-contacts are used for electrical connections, eliminating direct exposure and potential damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional fabrication processes are used for chip packaging, then manufacturing simplicity is maintained, but sensing devices are contaminated or damaged leading to reduced performance and reliability

Engineering Contradiction:

Improvesensing device performanceVSAvoidcontamination and damage to sensing devices

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The capping layer is attached to the substrate before the dicing process, covering and protecting the sensing device in advance. This preliminary protective action prevents contamination and damage during subsequent fabrication steps that would otherwise expose the sensing device to harmful factors.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The capping layer acts as an intermediary protective barrier between the sensing device and the external environment during fabrication processes. This intermediate layer shields the sensitive sensing device from direct exposure to contaminants and mechanical damage while allowing the dicing process to proceed on the substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the sensing device is exposed during fabrication processes, then manufacturing simplicity is maintained, but the sensing device is vulnerable to contamination and damage

Engineering Contradiction:

Improvefabrication process simplicityVSAvoidsensing device reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The capping layer is attached to the substrate before the dicing process, covering and protecting the sensing device in advance. This preliminary protective action prevents contamination and damage during subsequent fabrication steps that would otherwise expose the sensing device to harmful factors.

Inventive Principle:

Principle #10Preliminary action

3Productivity

If wafer-level packaging is used, then productivity and cost are improved, but the sensing device requires protection during dicing

Engineering Contradiction:

Improvechip package production efficiencyVSAvoiddamage risk during dicing

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The capping layer acts as an intermediary protective barrier between the sensing device and the external environment during fabrication processes. This intermediate layer shields the sensitive sensing device from direct exposure to contaminants and mechanical damage while allowing the dicing process to proceed on the substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The capping layer is attached to the substrate before the dicing process, covering and protecting the sensing device in advance. This preliminary protective action prevents contamination and damage during subsequent fabrication steps that would otherwise expose the sensing device to harmful factors.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively protects sensing devices from contamination and damage, enhancing their performance and the overall reliability and quality of chip packages while reducing processing costs and package size through wafer-level packaging and alternative electrical connections.

Implementation Method 1

The capping layer is attached to the first surface of the substrate by an adhesive layer, and the adhesive layer covers the sensing device

Methodology Applied

Scientific EffectAdhesive: Adhesive

Data Source

PatentUS9611143B2Method for forming chip package

Publication Date: 2017.04.04 XINTEC INC

AI summary

A method for forming a chip package is provided. The method includes providing a substrate and a capping layer, wherein the substrate has a sensing device therein adjacent to a surface of the substrate. The capping layer is attached to the surface of the substrate by an adhesive layer, wherein the adhesive layer covers the sensing device. A dicing process is performed on the substrate, the adhesive layer, and the capping layer along a direction to form individual chip packages.