Chip Package With Cavity Carrier And Side Wall Thermal Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional chip packaging materials with poor thermal conductance limit the heat dissipation capabilities of compact chip technologies, leading to performance limitations in power semiconductor chips due to insufficient heat spreading and thermal conduction.
Innovation Solution
A chip package design featuring a carrier with cavities and thermally conductive intermediate layers on the chip's side walls to enhance heat dissipation, utilizing materials with high thermal conductance such as metals and solder materials to increase the surface area for heat transfer from the chip to the carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional organic materials are used to surround and insulate the chip, then electrical insulation is achieved, but thermal conductance is insufficient (approximately 1 W/mK)
Solution Approach 1:
The patent divides the thermal management function into multiple segments: the carrier provides structural support and primary heat sinking, while intermediate layers with high thermal conductance are strategically placed at the chip-carrier interface and along side walls to create multiple thermal conduction pathways, effectively segmenting the heat dissipation route to overcome the limitations of single-material approaches
Solution Approach 2:
The patent employs composite material structures combining materials with different thermal and electrical properties. The carrier uses materials like copper or aluminum alloys for high thermal conductance, while intermediate layers utilize solder materials or metal matrices with thermal conductance exceeding 10 W/mK. This composite approach allows simultaneous achievement of electrical insulation and superior thermal management
2Area of moving object
If chip size is reduced for compact technology, then integration density increases, but heat spreading area decreases leading to thermal limitations
Solution Approach 1:
The patent transitions from two-dimensional heat spreading on the chip surface to three-dimensional heat dissipation by utilizing vertical side walls and extending thermal conduction pathways through the carrier thickness. Intermediate layers are applied on side walls to create additional thermal conduction surfaces in the vertical dimension, effectively increasing heat spreading capability without increasing chip footprint area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat spreading and dissipation capabilities, effectively addressing the thermal limitations of compact chip technologies by increasing the available surface area for thermal conduction and enhancing cooling efficiency, particularly for small power semiconductor chips.
Implementation Method 1
the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier
Data Source
AI summary
A chip package is provided, the chip package including: a carrier including at least one cavity; a chip disposed at least partially within the at least one cavity; at least one intermediate layer disposed over at least one side wall of the chip; wherein the at least one intermediate layer is configured to thermally conduct heat from the chip to the carrier.