Chip Package Coded Structure for RDL-Based Product Identification
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Solution Overview
Problem
The challenge lies in efficiently tracking, identifying, and managing chip package structures due to their similar appearances, which makes it difficult to distinguish between manufacturing processes and finished products, leading to inefficiencies in product recognition and management.
Innovation Solution
A package structure incorporating a coded structure with a readable pattern is introduced, which includes a first and second redistribution circuit structure, a conductive member, and an encapsulant, allowing for efficient product tracking and management through the use of a coded pattern on the second redistribution circuit structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If chip package structures use similar appearances for different chips, then manufacturing cost is reduced and design flexibility is improved, but product identification and tracking become difficult
Solution Approach 1:
The invention segments the package structure into functional components (encapsulant, redistribution circuit structures, conductive members) and adds a separate coded structure element for identification. This allows the main package to maintain design flexibility while the coded structure provides unique identification without affecting the core design.
Solution Approach 2:
The coded structure acts as an intermediary element that bridges the gap between identical-looking packages. It provides a mechanism for identification and tracking without altering the fundamental appearance or function of the chip package structures, enabling differentiation while maintaining design consistency.
2Device complexity
If chip package structures are made visually identical, then manufacturing complexity is reduced, but tracking and management efficiency deteriorates
Solution Approach 1:
The coded structure is formed as part of the manufacturing process itself, specifically as the second redistribution circuit structure is being created. This preliminary action embeds identification capabilities during manufacturing without requiring separate tracking systems or post-manufacturing modifications.
Solution Approach 2:
The second redistribution circuit structure serves dual functions: its electrical function in signal transmission and its role as a carrier for the coded structure for identification. This multi-functionality reduces overall manufacturing complexity by combining identification capabilities with existing structural elements.
3Loss of information
If a coded structure is added to the package, then product identification and management are improved, but manufacturing process complexity increases
Solution Approach 1:
The invention merges the coded structure formation with the existing second redistribution circuit structure manufacturing process. By combining these operations, the coded structure is created using the same manufacturing steps and equipment already required for the circuit structure, avoiding the need for separate identification element fabrication.
Solution Approach 2:
The manufacturing process for the second redistribution circuit structure automatically creates the coded structure as well. The process serves dual purposes: building the electrical circuit and embedding the identification code, allowing the system to self-generate identification capabilities without external intervention.
Data Source
AI summary
A package structure including a chip, an encapsulant, a first redistribution circuit structure, a second redistribution circuit structure, a conductive member, and a coded structure is provided. The encapsulant has a first encapsulating surface and a second encapsulating surface opposite thereto. The encapsulant covers the chip. The first redistribution circuit structure is disposed on the first encapsulating surface of the encapsulant. The second redistribution circuit structure is disposed on the second encapsulating surface of the encapsulant. The chip is electrically connected to the first redistribution circuit structure or the second redistribution circuit structure. The conductive member penetrates through the encapsulant to be electrically connected to the first redistribution circuit structure and the second redistribution circuit structure. The coded structure is disposed on the second redistribution circuit structure. The coded structure includes a readable coded pattern.