Chip Package Contact Structure for Flexible Vertical Interconnects
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Solution Overview
Problem
Existing chip packages require multiple vertical interconnects such as stud bumps, copper pillars, and vertical wires, which have limitations in height, stiffness, and manufacturing efficiency.
Innovation Solution
A chip package design featuring a continuous longitudinally extended electrically conductive element attached to a contact pad in multiple positions, bending away between pairs of consecutive positions, partially encapsulated with an outer surface exposure, allowing for flexible interconnect height and reduced manufacturing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple vertical interconnects (stud bumps, copper pillars, vertical wires) are used, then electrical connection is achieved, but manufacturing time and complexity increase
Solution Approach 1:
The patent merges multiple separate vertical interconnect structures into a single continuous conductive element that provides multiple electrical connections simultaneously. This single element replaces what would traditionally require multiple discrete components, reducing manufacturing steps and time while maintaining reliable electrical connections.
Solution Approach 2:
The continuous conductive element serves multiple functions simultaneously: it provides electrical connection at multiple contact positions, acts as a structural support, and enables thermal management. This multi-functional design eliminates the need for separate components for each function, streamlining the manufacturing process.
2Reliability
If multiple vertical interconnects are used, then electrical connection is established, but device complexity increases
Solution Approach 1:
The patent combines multiple interconnect functions into a single continuous conductive element with a optimized profile. This unified structure reduces device complexity by eliminating the need for multiple discrete components, alignment steps, and joining processes that would be required with traditional multi-component interconnect structures.
3Ease of manufacture
If traditional vertical interconnects are used, then manufacturing is straightforward, but contact surface area is limited
Solution Approach 1:
The patent transitions from traditional point-contact or small-area vertical interconnects to a continuous conductive element with extended surface area. The element's profile is designed to provide multiple contact positions along its length, effectively adding a dimensional aspect to the contact interface that significantly increases total contact surface area while maintaining manufacturing feasibility.
4Stability of the object's composition
If rigid vertical interconnects are used, then structural stability is achieved, but flexibility in height adjustment is lost
Solution Approach 1:
The patent introduces a conductive element with a flexible profile that can be configured in different heights and shapes while maintaining structural stability. The element's design allows for adaptation to different package configurations without requiring rigid, fixed-height structures, enabling both stability and design flexibility simultaneously.
Data Source
AI summary
A chip package includes a chip with at least one contact pad, a contact structure formed from at least one continuous longitudinally extended electrically conductive element by attaching the conductive element to the contact pad in at least three contact positions, wherein the conductive element bends away from the contact pad between pairs of consecutive contact positions, and an encapsulation partially encapsulating the contact structure, wherein the encapsulation includes an outer surface facing away from the chip, and wherein the contact structure is partially exposed at the outer surface.