Chip Package Structure With Coplanar 2D Code Marking
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Solution Overview
Problem
Conventional chip package structures have recognition codes printed on the top side of the encapsulant, which are not coplanar and thus easily damaged, leading to unrecognizable codes.
Innovation Solution
A chip package structure that includes a substrate, a chip module, an encapsulant with a patterned trench, and a recognition contrast layer. The recognition contrast layer is filled in the patterned trench and is coplanar with the top surface of the encapsulant, forming a predetermined 2D code pattern that is resistant to damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the recognition code is printed on the top side of the encapsulant, then the code can be easily applied, but the code is not coplanar and easily damaged
Solution Approach 1:
The patent creates recesses in the encapsulant surface before applying the recognition code material. This preliminary action allows the code to be formed in a protected, recessed position that will be coplanar with the surface after curing, preventing damage while maintaining ease of application through pre-defined mold cavities
Solution Approach 2:
The patent introduces a flexible polyurethane material as an intermediary layer between the encapsulant surface and the recognition code. This intermediary material allows the code to be applied easily while providing cushioning and protection, ensuring the code remains coplanar and damage-resistant
2Reliability
If the recognition code is made coplanar with the top surface, then the code becomes damage-resistant, but the manufacturing process becomes more complex
Solution Approach 1:
The recesses are formed in the encapsulant during the molding process itself, before the recognition code is applied. This preliminary formation of cavities eliminates the need for post-processing steps to create coplanar surfaces, maintaining manufacturing simplicity while achieving code protection
Solution Approach 2:
The patent changes the physical state and properties of the recognition code material by using a flexible polyurethane that can be applied in a soft state and then cures to a rigid, coplanar finish. This parameter change allows the code to be easily applied yet become damage-resistant when cured
Data Source
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AI summary
A chip package structure (100) and a package module (3) thereof are provided. The package module (3) includes an encapsulant (31) and a recognition contrast layer (32). The encapsulant (31) has a patterned trench (312) that is recessed in a top surface (311) thereof and that corresponds in shape to a predetermined two-dimensional (2D) code pattern. The recognition contrast layer (32) is filled in the patterned trench (312). The recognition contrast layer (32) and the top surface (311) of the encapsulant (31) respectively have different colors that conform to grade A or grade B in the ISO/IEC 15415 standard. The recognition contrast layer (32) is coplanar with the top surface (311) of the encapsulant (31) so as to jointly form the predetermined 2D code pattern having a planar shape.