Chip Package Cover Block for MEMS Vibration Control

Solution Overview

Problem

Conventional chip package structures for micro-electro-mechanical systems, such as MEMS, require costly and time-consuming etching processes to fabricate silicon covers with protruding portions, limiting the vibration of inertial objects and increasing production costs.

Innovation Solution

A chip package structure is formed by mounting a cover with a block on a substrate, where the block limits the movement of an inertial object within acceptable ranges, eliminating the need for etching and using cost-effective organic insulation materials like epoxy or silicone for the block, which is formed by printing or exposure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a silicon cover with protruding portion is made by etching, then the inertial object vibration is limited within acceptable range, but the fabrication process takes long time and has high cost

Engineering Contradiction:

Improveinertial object vibration controlVSAvoidfabrication time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces the expensive and time-consuming etched silicon cover with a cost-effective organic insulation material block (epoxy or silicone) that is formed through simpler processes like printing or exposure. This disposable-like approach using inexpensive materials achieves the same vibration limiting function without the complex etching steps, directly reducing both time and cost while maintaining reliability

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameter from inorganic silicon to organic insulation materials (epoxy, silicone), and changes the formation process parameter from etching to printing/exposure. This parameter substitution maintains the functional parameter of vibration control while dramatically reducing fabrication time and cost

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a silicon cover with protruding portion is made by etching, then the inertial object vibration is limited within acceptable range, but various materials and high cost are required

Engineering Contradiction:

Improveinertial object vibration controlVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the expensive and time-consuming etched silicon cover with a cost-effective organic insulation material block (epoxy or silicone) that is formed through simpler processes like printing or exposure. This disposable-like approach using inexpensive materials achieves the same vibration limiting function without the complex etching steps, directly reducing both time and cost while maintaining reliability

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent substitutes the mechanical etching process with a chemical or photopolymerization process. Instead of using mechanical removal of silicon through etching, the invention uses organic materials that can be formed through printing or exposure methods, replacing a complex mechanical system with a simpler chemical/process-based system

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If a silicon cover with protruding portion is made by etching, then the vibration limitation function is achieved, but multiple etching steps are required

Engineering Contradiction:

Improvevibration limitation functionVSAvoidetching process steps

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces the expensive and time-consuming etched silicon cover with a cost-effective organic insulation material block (epoxy or silicone) that is formed through simpler processes like printing or exposure. This disposable-like approach using inexpensive materials achieves the same vibration limiting function without the complex etching steps, directly reducing both time and cost while maintaining reliability

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent extracts and removes the complex etching process steps from the manufacturing flow. By using organic insulation materials that can be formed through printing or exposure, the invention takes out the multi-step etching process entirely, simplifying the device complexity while maintaining the essential vibration limitation function

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS8981497B2Chip package structure and method for forming the same

Publication Date: 2015.03.17 XINTEC INC

AI summary

A chip package structure and a method for forming the chip package structure are disclosed. At least a block is formed on a surface of a cover, the cover is mounted on a substrate having a sensing device formed thereon for covering the sensing device, and the block is disposed between the cover and the sensing device. In the present invention, the block is mounted on the cover, there is no need to etch the cover to form a protruding portion, and thus the method of the present invention is simple and has low cost.