Chip Package Heat Spreaders for Independent Die Force Control
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Solution Overview
Problem
Conventional chip packaging schemes face challenges in thermal management, particularly when multiple IC dies are laterally disposed on a substrate, leading to inadequate cooling and potential device failure due to differing force limits of each die, resulting in poor electrical connections and heat transfer.
Innovation Solution
The use of separate heat spreaders interfaced with each IC die allows independent control of the force applied, enabling effective thermal management and electrical contact optimization by using a first heat spreader for the first IC die and a second heat spreader for the second IC die, with a flexible heat pipe for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single heat spreader is used for multiple IC dies, then device complexity is reduced, but thermal management effectiveness deteriorates due to inability to apply optimal force to each die
Solution Approach 1:
The patent divides the thermal management system into separate heat spreaders for each IC die. Specifically, a first heat spreader is coupled to a first IC die and a second heat spreader is coupled to a second IC die, allowing independent force application and optimization for each die's thermal and electrical requirements.
2Ease of manufacture
If force is applied uniformly to multiple IC dies, then manufacturing process is simplified, but electrical connection quality deteriorates due to differing force limits of each die
Solution Approach 1:
The patent implements separate heat spreaders that can be independently adjusted to apply optimal force to each IC die. The first heat spreader applies a first force to the first IC die, while the second heat spreader applies a second force to the second IC die, with each force independently optimized for its respective die's force limit.
Solution Approach 2:
The patent applies different force levels to different IC dies based on their individual requirements. Each heat spreader is configured with local adjustments to match the specific force limit and thermal requirements of each IC die, rather than applying a uniform force across all dies.
3Device complexity
If force applied to IC dies is not independently controlled, then device structure is simplified, but thermal transfer efficiency deteriorates due to poor heat transfer from at least one IC die
Solution Approach 1:
The patent separates the thermal management into independent heat spreaders for each IC die. The first heat spreader is thermally coupled to the first IC die and the second heat spreader is thermally coupled to the second IC die, enabling independent force control to optimize thermal contact and heat transfer efficiency for each die.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved thermal management, longer service life, and enhanced reliability of chip packages by allowing independent force control and optimized electrical connections for IC dies with different maximum safe force loads.
Implementation Method 1
separate heat spreaders interfaced with the IC dies... The flexible heat pipe is in thermal contact with the second heat spreader
Implementation Method 2
The flexible heat pipe is in thermal contact with the second heat spreader and is movable with the second heat spreader relative to the first heat spreader
Data Source
AI summary
Chip packages and methods for fabricating the same are provided which utilize a first heat spreader interfaced with a first integrated circuit (IC) die and a second heat spreader separately interfaced with a second IC die. The separate heat spreaders allow the force applied to the first IC die to be controlled independent of the force applied to the second IC die.