IC Chip Package Disabling via Photovoltaic Removal Trigger
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Solution Overview
Problem
Integrated circuits (ICs) removed from circuit boards can be read or compromised, posing security risks, particularly in scenarios where programmable parts need to be secured before leaving a facility for repair or return.
Innovation Solution
A chip package design incorporating a photovoltaic cell and light blocking shield that generates an electrical current when exposed to light upon removal from the circuit board, triggering disabling logic to either damage or secure the IC substrate, or a mechanical post assembly that physically destroys the IC substrate upon removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the IC substrate is made removable from the circuit board for repair or return, then ease of operation is improved, but security is worsened as the IC can be read or compromised
Solution Approach 1:
The patent implements a preliminary disabling mechanism that activates automatically when the IC substrate is removed from the circuit board. A light-blocking shield normally covers a photovoltaic cell during operation, but when removed, light exposure generates electrical current that triggers disabling logic to corrupt data or brick the IC substrate, preventing unauthorized access before the removal action completes
Solution Approach 2:
The patent converts the potentially harmful effect of light exposure (which could activate unauthorized reading) into a beneficial security feature. The photovoltaic cell uses ambient light to generate the electrical current needed to trigger the disabling mechanism, turning the very condition that enables removal into the activation signal for security protection
2Object-affected harmful factors
If a photovoltaic cell and light blocking shield are added to enable automatic disabling, then security is improved, but device complexity is worsened
Solution Approach 1:
The patent implements a self-service security mechanism where the IC substrate's own removal action triggers its disabling. The light-blocking shield and photovoltaic cell create a self-activating system that detects removal through light exposure and automatically executes the disabling sequence without external intervention, making the security feature pay for itself
Solution Approach 2:
The patent replaces complex mechanical switching mechanisms with an optical-electrical system. Instead of using mechanical switches or sensors to detect removal, the system uses light exposure to activate a photovoltaic cell, which generates current to trigger electronic disabling logic, simplifying the overall mechanical complexity
3Object-affected harmful factors
If a mechanical post assembly is used to physically destroy the IC substrate, then security is improved, but device complexity is worsened
Solution Approach 1:
The patent extracts the destruction function into a separate mechanical component (the post assembly with sharp edge) that is spatially distinct from the IC substrate. The post is positioned such that removal motion naturally drives it into the substrate, separating the destruction mechanism from the IC itself while maintaining functional integration
Solution Approach 2:
The patent uses the periodic/removal action of taking the IC substrate off the circuit board as the trigger for destruction. The same motion that enables removal also activates the post to pierce the substrate, converting the removal cycle into a security enforcement event
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures the IC substrate is rendered unreadable or permanently damaged when removed from the circuit board, providing a layer of code security and preventing unauthorized access or data retrieval.
Implementation Method 1
a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light
Data Source
AI summary
A chip package comprises: an IC substrate, wherein the IC substrate comprises at least one electronic device; a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light; a light blocking shield, wherein the light blocking shield prevents light from striking the photovoltaic cell only while the chip package is mounted on a circuit board, and wherein the light blocking shield ceases to prevent light from striking the photovoltaic cell upon the chip package being dismounted from the circuit board; and a disabling logic, wherein the electrical current, which is generated by the photovoltaic cell in response to the chip package being dismounted from the circuit board, causes the disabling logic to disable the IC substrate.