Chip Package Edge Optical Fiber Self-Alignment
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Solution Overview
Problem
Existing optical fiber connection technologies on package edges lack efficient self-alignment and stability, leading to longer connection lengths and increased footprint, which hinders the integration of optical fibers with chip packages.
Innovation Solution
A chip package design that incorporates an optical window component, a connector-retaining shape formed by mold pressing or sawing, and a notch or cut to facilitate self-alignment of optical fibers, allowing for direct connection and reduced system footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional optical fiber connection methods are used on package edges, then mechanical coupling and optical coupling can be achieved, but the connection length increases and the system footprint increases due to lack of efficient self-alignment
Solution Approach 1:
The package edge structure incorporates self-aligning features including a recess that receives the optical fiber connector and alignment pins that automatically position the connector during insertion. The connector housing includes corresponding alignment features that mate with pins on the package edge, enabling the connection to self-align without external alignment tools or complex positioning mechanisms, thereby reducing connection length while maintaining reliability
Solution Approach 2:
An intermediate connector housing structure serves as a mediator between the optical fiber and the package edge. The housing includes a recess that receives the connector, alignment pins that interface with corresponding features on the package edge, and provides mechanical support. This intermediate structure enables both mechanical coupling and optical coupling while facilitating self-alignment, thus reducing the required connection length
2Reliability
If conventional optical fiber connection methods are used on package edges, then optical coupling can be achieved, but the system footprint increases due to longer connection lengths
Solution Approach 1:
The self-aligning connection structure eliminates the need for external alignment fixtures, mounting brackets, or complex positioning mechanisms that would increase footprint. The alignment pins and recess features are integrated directly into the package edge and connector housing, allowing the optical fiber connection to self-position within a compact volume, thereby reducing system footprint while maintaining optical coupling stability
Solution Approach 2:
The connector housing merges multiple functions into a single integrated structure: it provides mechanical support, optical alignment, strain relief, and electrical isolation. The recess in the housing combines the functions of a mounting structure and an alignment feature, while the alignment pins integrate positioning and mechanical coupling functions. This merging reduces the number of separate components and reduces overall system footprint
3Length of stationary object
If self-aligning features are added to the package edge, then connection length can be reduced, but device complexity increases
Solution Approach 1:
The alignment system is segmented into discrete, simple features: cylindrical alignment pins on the package edge and corresponding recesses with alignment holes in the connector housing. This segmentation breaks down the complex alignment function into simple geometric features that are easy to manufacture and assemble, reducing the perceived complexity while achieving self-alignment and reducing connection length
4Productivity
If direct edge connection is implemented, then integration ratio can be increased, but manufacturing precision requirements increase
Solution Approach 1:
The alignment pins and recess features are designed to self-align during assembly, compensating for normal manufacturing tolerances. The cylindrical pins fit into corresponding holes with clearance that accommodates typical machining variations, and the recess geometry guides the connector into proper alignment. This self-aligning mechanism enables direct edge connection and high integration ratio without requiring ultra-precise manufacturing, as the features automatically correct for moderate tolerance deviations
Data Source
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AI summary
Embodiments of the disclosure are directed to a chip package that includes a base that includes a redistribution layer; an optical transducer circuit element on the base electrically connected to the redistribution layer; an optical element adjacent to the optical transducer circuit element and at an edge of the base; and an encasement encasing the optical transducer circuit element and a portion of the optical element, wherein one side of the optical element is exposed at an edge of the encasement and at the edge of the printed circuit board.