Chip Package Circuit Layer Openings for Edge Stress Relief
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Solution Overview
Problem
The existing electronic device package structures are prone to damage due to stress, particularly affecting the redistribution layers, which can lead to reliability issues and increased risk of cracking or chipping, especially around the chip's sides.
Innovation Solution
The electronic device incorporates a circuit structure layer with a redistribution structure layer and an element structure layer, both electrically connected to the chip, and featuring openings that overlap with the chip's sides, reducing stress and enhancing reliability by distributing it more evenly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the redistribution layer is made continuous and covers the entire chip area, then the electrical connection is improved, but the stress concentration increases leading to cracking or chipping
Solution Approach 1:
The continuous redistribution layer is segmented into multiple discrete portions, each corresponding to different functional regions of the chip. This segmentation allows the redistribution layer to maintain electrical connections where needed while creating gaps that relieve stress concentration, thereby preventing cracking or chipping at the chip edges.
Solution Approach 2:
The redistribution layer is designed with non-uniform distribution, having higher density in central regions requiring electrical connections and lower density or absence at edge regions prone to stress. This local quality variation optimizes both electrical connectivity and mechanical strength at different locations.
2Volume of moving object
If the package structure uses a compact design with layers closely spaced, then the device size is reduced, but the stress on redistribution layers increases
Solution Approach 1:
By segmenting the redistribution layer into discrete portions rather than a continuous structure, the patent reduces the cumulative stress on the layer while maintaining compact packaging. The gaps between segments act as stress relief zones, allowing the package to remain small without compromising layer integrity.
3Reliability
If the redistribution layer is made thicker to improve conductivity, then the electrical performance is enhanced, but the stress and risk of damage increase
Solution Approach 1:
Rather than increasing the thickness of a continuous redistribution layer (which would increase stress), the patent uses segmented portions that can be optimized locally. Each segment maintains sufficient thickness for conductivity where needed, while the overall segmented structure reduces cumulative stress and damage risk.
Data Source
AI summary
An electronic device includes a chip and a circuit structure layer overlapped with the chip. The circuit structure layer includes a redistribution structure layer and an element structure layer, and the redistribution structure layer and the element structure layer are electrically connected to the chip. At least one of the redistribution structure layer and the element structure layer includes at least one opening, and in a normal direction of the electronic device, the at least one opening is overlapped with aside of the chip.